Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
Plating film and plated member
US11380602B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11380602-B2 |
| Application number | US-201916977841-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 26, 2019 |
| Priority date | Mar 7, 2018 |
| Publication date | Jul 5, 2022 |
| Grant date | Jul 5, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Provided is a plating film containing Au and Tl, including Tl oxides including Tl2O on a surface of the plating film, a ratio of Tl atoms constituting Tl2O to a total of Tl atoms constituting the Tl oxides and Tl atoms constituting Tl simple substances on the surface being 40% or more.
First claim
Opening claim text (preview).
The invention claimed is: 1. A plating film containing Au and Tl, comprising: Tl oxides including Tl 2 O on a surface of the plating film, a ratio of Tl atoms constituting Tl 2 O to a total of Tl atoms constituting the Tl oxides and Tl atoms constituting zero valent Tl on the surface being 40% or more. 2. The plating film according to claim 1 , wherein a content of Tl contained in the entire plating film is 10 ppm or more and 600 ppm or less in mass ratio. 3. The plating film according to claim 1 , wherein the plating film has an average thickness of 0.1 μm or more. 4. A plated member comprising a base material and a plating film coating the base material, and to be joined to a mating member via an electrically conductive joining material, the plating film being the plating film according to claim 1 . 5. The plated member according to claim 4 , wherein the base material includes a plate material, and a film composed mainly of Ni coating the plate material, and the plate material is made of a metal including one type or more selected from Cu, Ag, Al, Mo, W, and Mg, or a composite material including one type or more selected from Cu, Ag, Al, Mo, W, and Mg and one type or more selected from diamond and silicon carbide.
Assignees
Inventors
Classifications
Connecting or disconnecting · CPC title
- H10W40/255Primary
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
with only oxides · CPC title
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Frequently asked questions
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- What does patent US11380602B2 cover?
- Provided is a plating film containing Au and Tl, including Tl oxides including Tl2O on a surface of the plating film, a ratio of Tl atoms constituting Tl2O to a total of Tl atoms constituting the Tl oxides and Tl atoms constituting Tl simple substances on the surface being 40% or more.
- Who is the assignee on this patent?
- Sumitomo Electric Industries, Almt Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W40/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).