Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-11380484-B2
Application number	US-202016869893-A
Country	US
Kind code	B2
Filing date	May 8, 2020
Priority date	Jan 23, 2020
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

A multilayer electronic component includes a body including a first internal electrode and a second internal electrode alternately disposed in a first direction with a dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction. A first external electrode is disposed on the third, fourth, fifth, and sixth surfaces. A second external electrode is disposed on one or more of the first and second surfaces, and a via electrode is exposed through a surface on which the second external electrode is disposed. A ratio W/L is 0.95 or more and 1.05 or less, where L is a length of the body and W is a width of the body.

First claim

What is claimed is:

1. A multilayer electronic component comprising: a body including a first internal electrode and a second internal electrode alternately disposed in a first direction of the body with a dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction of the body, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction of the body; a first external electrode surrounding the third, fourth, fifth, and sixth surfaces and connected to the first internal electrode; a second external electrode disposed on one or more of the first and second surfaces; and a via electrode being in contact with a surface on which the second external electrode is disposed, and connecting the second internal electrode and the second external electrode, wherein a ratio W/L is 0.95 or more and 1.05 or less, where Lisa dimension of the body in the second direction and W is a dimension of the body in the third direction, and the first external electrode is spaced apart from edges of the first or second surface.

2. The multilayer electronic component according to claim 1 , wherein L and W are each 0.5 mm or less.

3. The multilayer electronic component according to claim 1 , wherein the first internal electrode is in contact with each of the third to sixth surfaces, and
the second internal electrode is disposed to be spaced apart from each of the third to sixth surfaces.

4. The multilayer electronic component according to claim 3 , wherein a length and a width of the first internal electrode are substantially the same as a length and a width of the body, respectively.

5. The multilayer electronic component according to claim 1 , wherein the body includes a plurality of first internal electrodes and a plurality of second internal electrodes, and a number of each of the first and second internal electrodes in the body is 20 or less.

6. The multilayer electronic component according to claim 1 , wherein the first internal electrode comprises an insulating portion that provides a space between the first internal electrode and the via electrode, and
the via electrode is disposed to penetrate the second internal electrode and the insulating portion.

7. The multilayer electronic component according to claim 1 , wherein the multilayer electronic component includes a plurality of via electrodes.

8. The multilayer electronic component according to claim 7 , wherein the multilayer electronic component includes a plurality of second external electrodes each connected to the second external electrode by the plurality of via electrodes.

9. The multilayer electronic component according to claim 7 , wherein the second external electrode contacts each of the plurality of via electrodes on the first surface or the second surface.

10. The multilayer electronic component of claim 1 , wherein each of the first internal electrodes extends along a full width of each of the third, fourth, fifth, and sixth surfaces of the body.

11. The multilayer electronic component of claim 10 , wherein the first external electrode extends across the full width of each of the third, fourth, fifth, and sixth surfaces of the body.

12. The multilayer electronic component of claim 1 , further comprising one or more via electrodes extending through the body in the first direction to connect the second external electrode and the second internal electrodes.

13. The multilayer electronic component of claim 1 , wherein a ratio W 1 /L 1 is 0.95 or more and 1.05 or less, where L 1 and W 1 are dimensions of the first internal electrodes in respective second and third directions orthogonal to each other and the first direction.

14. The multilayer electronic component of claim 1 , wherein the first external electrode is spaced apart from each edge of the first and second surfaces.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jong Duck
• Won Jae Sun
• Yu Jae Joon

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title