Electronic device and housing unit for electronic device
US-10999951-B2 · May 4, 2021 · US
Immersion cooling apparatus
US11375638B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11375638-B2 |
| Application number | US-202016896349-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 9, 2020 |
| Priority date | Jan 15, 2020 |
| Publication date | Jun 28, 2022 |
| Grant date | Jun 28, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.
First claim
Opening claim text (preview).
What is claimed is: 1. An immersion cooling apparatus, configured to accommodate and cool at least one heat source, comprising: a tank; a coolant, accommodated in the tank and adapted to be in direct thermal contact with the at least one heat source; and a plurality of condensers, each comprising at least one heat pipe partially immersed in the coolant, wherein the plurality of condensers are respectively arranged at different inner walls of the tank and connected in serial manner to form a polygonal structure surrounding a central area of the tank so that the plurality of condensers are not vertically overlapping with the at least one heat source being arranged at the central area of the tank. 2. The immersion cooling apparatus according to claim 1 , further comprising at least one turbulence generator, wherein the at least one turbulence generator is located in the tank and configured to increase a disturbance of the coolant. 3. An immersion cooling apparatus, configured to accommodate and cool at least one heat source, comprising: a tank; a coolant, accommodated in the tank and adapted to be in direct thermal contact with the at least one heat source; and a plurality of condensers, each comprising at least one heat pipe fully immersed in the coolant, wherein the plurality of condensers are respectively arranged at different inner walls of the tank and connected in serial manner to form a polygonal structure surrounding a central area of the tank so that the plurality of condensers are not vertically overlapping with the at least one heat source being arranged at the central area of the tank. 4. The immersion cooling apparatus according to claim 3 , further comprising at least one turbulence generator, wherein the at least one turbulence generator is located in the tank and configured to increase a disturbance of the coolant.
Assignees
Inventors
Classifications
- H05K7/203Primary
by immersion · CPC title
- H05K7/20809Primary
within server blades for removing heat from heat source · CPC title
- H05K7/20818Primary
within cabinets for removing heat from server blades · CPC title
Condensers · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11375638B2 cover?
- The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.
- Who is the assignee on this patent?
- Wiwynn Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K7/203. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 28 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).