Electronic device and housing unit for electronic device

Patent metadata

Field	Value
Publication number	US-10999951-B2
Application number	US-201916695294-A
Country	US
Kind code	B2
Filing date	Nov 26, 2019
Priority date	Dec 26, 2018
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

An electronic device includes: a heat generating component; a board disposed in a vertical direction, the heat generating component mounted on a first surface of the board; a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board; a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member; a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members; a housing including a first wall portion superposed on a second surface of the first thermally conductive member, and a second wall portion opposite the first wall portion; and a heat sink provided on an outer surface of the second wall portion.

First claim

What is claimed is:

1. A liquid immersion cooling apparatus comprising:
a first housing configured to accommodate a cooling liquid and an electronic device, the electronic device including:
a heat generating component configured to be immersion-cooled in the cooling liquid;
a board disposed in a vertical direction, the heat generating component mounted on a first surface of the board; and
a second housing configured to accommodate the heat generating component and the board, the second housing being formed by a plurality of thermally conductive members so as to include a first opening as an outlet of the cooling liquid and a second opening as an inlet of the cooling liquid, the first opening being placed at an upper portion in the vertical direction with respect to the heat generating component, the second opening being place at a lower portion in the vertical direction with respect to the heat generating component, any one of the plurality of thermally conductive members being coupled to the first housing,
the plurality of thermally conductive members include:
a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board;
a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member, the plurality of second thermally conductive members having respective distal end portions positioned on a side opposite the board relative to the heat generating component; and
a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members.

2. The electronic device according to claim 1 , wherein the first housing includes:
a first wall portion superposed on a second surface of the first thermally conductive member;
a second wall portion opposite the first wall portion; and
a heat sink provided on an outer surface of the second wall portion,
the electronic device further comprising:
a fourth thermally conductive member superposed on the second wall portion from inside of the first housing;
a plurality of fifth thermally conductive members that extend in the horizontal direction from the fourth thermally conductive member toward the third thermally conductive member; and
a sixth thermally conductive member that is secured to distal end portions of the plurality of fifth thermally conductive members and that faces the third thermally conductive member.

3. The electronic device according to claim 1 , further comprising:
a first heat sink provided on an outer surface of the first housing; and
a second heat sink in contact with the heat generating component,
wherein the distal end portions of the plurality of second thermally conductive members are positioned on a side opposite the board relative to the heat generating component and the second heat sink.

4. A housing unit for a liquid immersion cooling apparatus, the housing unit comprising:
a first housing; and
a second housing,
the first housing being configured to accommodate a cooling liquid and the second housing,
the second housing being configured to accommodate a heat generating component mounted on a first surface of a board, the heat generating component being configured to be immersion-cooled in the cooling liquid, the second housing being formed by a plurality of thermally conductive members so as to include a first opening as an outlet of the cooling liquid and a second opening as an inlet of the cooling liquid, the first opening being placed at an upper portion in the vertical direction with respect to the heat generating component, the second opening being place at a lower portion in the vertical direction with respect to the heat generating component, any one of the plurality of thermally conductive members being coupled to the first housing,
the plurality of thermally conductive members include:
a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board;
a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member, the plurality of second thermally conductive members having respective distal end portions positioned on a side opposite the board relative to the heat generating component;
a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members.

Assignees

• Fujitsu Ltd

Inventors

• Tsunoda Yosuke

Classifications

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20236 Primary

  by immersion · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20245 Primary

  by natural convection; Thermosiphons · CPC title

• H05K7/203

  by immersion · CPC title