Stacked microfeature devices and associated methods

Patent metadata

Field	Value
Publication number	US-11373979-B2
Application number	US-201816104862-A
Country	US
Kind code	B2
Filing date	Aug 17, 2018
Priority date	Aug 29, 2003
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

First claim

We claim:

1. A microfeature device package, comprising:
a first microfeature device having a first bond pad surface with a first bond pad and a first intermediate bond pad electrically isolated from the first bond pad;
a second microfeature device proximate to the first microfeature device, the second microfeature device having a second bond pad surface with a second bond pad and a second intermediate bond pad electrically connected to the second bond pad, the second bond pad surface facing toward the first bond pad surface of the first microfeature device;
a first wirebond between the first bond pad and a first package connection site;
a second wirebond between the first intermediate bond pad and a second package connection site; and
an electrically conductive member between the first intermediate bond pad and the second intermediate bond pad.

2. The microfeature device package of claim 1 wherein the electrically conductive member comprises a volume of solder between the first bond pad and the first intermediate bond pad.

3. The microfeature device package of claim 1 wherein the electrically conductive member comprises at least one of a gold stud bump, a copper stud bump, and a solder bump.

4. The microfeature device package of claim 1 , wherein the second intermediate bond pad is physically and electrically bonded to the first intermediate bond pad.

5. The microfeature device package of claim 1 , further comprising an encapsulant adjacent to the first and second microfeature devices.

6. The microfeature device package of claim 1 wherein the first microfeature device is generally similar to the second microfeature device, and wherein the first microfeature device is stacked on top of the second microfeature device.

7. The microfeature device package of claim 1 , wherein the second bond pad is in electrical communication with components external to the device package via the first intermediate bond pad, the second intermediate bond pad, and the electrically conductive member.

8. A microfeature device package, comprising:
a first microfeature device stacked over a second microfeature device, the first microfeature device having a first bond pad surface with a plurality of first bond pads and first intermediate bond pads electrically isolated from the first bond pads, and the second microfeature device having a second bond pad surface with a plurality of second bond pads and second intermediate bond pads electrically coupled to at least one of the second bond pads, wherein the second bond pad surface faces toward the first bond pad surface;
an electrically conductive member between individual first and second intermediate bond pads;
a first wirebond between one of the plurality of first bond pads and a first package connection site; and
a second wirebond between one of the plurality of first intermediate bond pads and a second package connection site.

9. The microfeature device package of claim 8 , wherein individual first and second intermediate bond pads are aligned with each other.

10. The microfeature device package of claim 8 wherein the first intermediate bond pads are disposed along a first axis of the first microfeature workpiece, and wherein the second intermediate bond pads are disposed along a second axis of the second microfeature workpiece, and wherein individual first and second intermediate bond pads are vertically aligned along the first and second axes of the first and second microfeature workpieces.

11. The microfeature device package of claim 8 wherein the electrically conductive member comprises a volume of solder between individual first bond pads and second bond pads.

12. A microfeature device package, comprising:
a first microfeature device having a first bond pad surface, a plurality of first bond pads at the first bond pad surface, a plurality of first wirebond pads positioned outwardly from the first bond pads, and a plurality of first couplers electrically coupling individual first bond pads to corresponding first wirebond pads, wherein the plurality of first bond pads include one or more intermediate bond pads each electrically isolated from any other first bond pad in the plurality of first bond pads;
a second microfeature device at least proximate to the first microfeature device, wherein the second microfeature device includes a plurality of second bond pads at a second bond pad surface, wherein the second bond pad surface faces at least partially toward the first bond pad surface, wherein at least one of the plurality of second bond pads is electrically coupled to an auxiliary bond pad; and
an electrically conductive member between each of the one or more intermediate bond pads and a corresponding second bond pad of the second microfeature device;
wherein at least one of the plurality of first bond pads is electrically coupled to a first package connection site; and
wherein the at least one of the plurality of second bond pads is electrically coupled to a second package connection site via a corresponding one of the intermediate bond pads and the auxiliary bond pad.

13. The microfeature device package of claim 12 wherein the second microfeature device is aligned such that at least a portion of the first wirebond pads are over at least a portion of the second bond pads of the second microfeature device.

14. The microfeature device package of claim 12 wherein the first microfeature device is generally similar to the second microfeature device, and wherein the second microfeature device is stacked on top of the first microfeature device.

15. The microfeature device package of claim 12 wherein the plurality of first wirebond pads includes a first plurality of first wirebond pads at a first side of the first bond pad surface and a second plurality of first wirebond pads at a second side of the first bond pad surface.

16. The microfeature device package of claim 15 wherein the first plurality of individual first wirebond pads and the second plurality of individual first wirebond pads are electrically connected to one another via corresponding first bond pads.

17. The microfeature device package of claim 12 wherein individual first wirebond pads and corresponding first bond pads are spaced apart from one another by corresponding first couplers.

18. The microfeature device package of claim 12 , further comprising an encapsulant at least partially covering the first microfeature device and the second microfeature device.

19. The microfeature device package of claim 12 wherein the plurality of first bond pads are arranged along a straight axis adjacent a center line of the first bond pad surface.

20. The microfeature device package of claim 12 wherein the second bond pads of the second microfeature device includes a second wirebond pad.

21. A microfeature device package, comprising:
a first microfeature device stacked over a second microfeature device, wherein the first microfeature device includes a plurality of first bond pads at a first bond pad surface, a plurality of first wirebond pads positioned outwardly from the first bond pads, and a plurality of first couplers electrically coupling individual first bond pads to corresponding first wirebond pads, and wherein:
the second microfeature device includes a plurality of second bond pads at a second bond pad surface,
the second bond pad surface facing at least partially toward the first bond pad surface, and
the plurality of first bond pads includes at least one intermediate bond pad electrically isolated

Assignees

• Micron Technology Inc

Inventors

• Heng Mung Suan
• Tan Kok Chua
• Leong Vince Chan Seng
• Johnson Mark S

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title