Information carrying card comprising a cross-linked polymer composition, and method of making the same

Patent metadata

Field	Value
Publication number	US-11359085-B2
Application number	US-202017092872-A
Country	US
Kind code	B2
Filing date	Nov 9, 2020
Priority date	Apr 3, 2012
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

First claim

What is claimed is:

1. A core layer for a plurality of information carrying cards, comprising
a thermoplastic layer defining a plurality of cavities therein;
a plurality of inlay layers, each respective inlay layer comprising at least one electronic component, which is partially or fully disposed inside one respective cavity of the plurality of the cavities; and
a crosslinked polymer composition disposed in the plurality of cavities and contacting each electronic component, the crosslinked polymer composition comprising:
a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy,

wherein the crosslinked polymer composition at least partially defines an outer surface of the core layer, each inlay layer is fully embedded inside the crosslinked polymer composition, and the outer surface of the core layer is an upper surface of the core layer opposite to a bottom surface of the thermoplastic layer.

2. The core layer of claim 1 wherein each respective cavity has a respective continuous surface profile solely defined by and inside the thermoplastic layer, the continuous surface profile having a respective bottom wall surface and a respective side wall surface.

3. The core layer of claim 1 wherein each respective inlay layer comprises a supporting film, and the respective at least one electronic component is embedded or mounted on the supporting film.

4. The core layer of claim 1 wherein the thermoplastic layer comprises a material selected from the group consisting of polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS).

5. The core layer of claim 1 wherein, for each respective inlay layer, the at least one electronic component comprises at least one integrated circuit (IC) or a battery, wherein the at least one IC is partially or fully disposed inside the respective cavity and over the thermoplastic layer.

6. The core layer of claim 1 wherein the base polymer resin in the crosslinked polymer composition is epoxy or urethane acrylate.

7. The core layer of claim 1 , wherein the crosslinked polymer composition defines a respective portion of the upper surface of the core layer over each respective cavity.

8. The core layer of claim 1 , wherein the crosslinked polymer composition and the thermoplastic layer define the upper surface of the core layer.

9. The core layer of claim 1 wherein the outer surface of the core layer has a portion over each respective cavity, and the crosslinked polymer composition fully defines the portion of the outer surface over each respective cavity.

10. The core layer of claim 1 wherein each respective cavity has a size larger than that of a respective inlay layer, which is fully disposed inside the respective cavity.

11. The core layer of claim 1 wherein each respective cavity has a size the same as or slightly larger than that of a respective inlay layer, and has a shape matching with that of the respective inlay layer.

12. A core layer for a plurality of information carrying cards, comprising
a thermoplastic layer defining a plurality of cavities therein;
a plurality of inlay layers, each inlay layer comprising at least one electronic component partially or fully disposed inside a respective cavity; and
a crosslinked polymer composition disposed in the plurality of cavities and contacting each electronic component, the crosslinked polymer composition comprising:
a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy,

wherein the crosslinked polymer composition at least partially defines an outer surface of the core layer, each inlay layer is fully embedded inside the crosslinked polymer composition, and the outer surface of the core layer is an upper surface of the core layer opposite to a bottom surface of the thermoplastic layer,
wherein each respective cavity has a size the same as or larger than that of the respective inlay layer.

13. The core layer of claim 12 wherein each respective cavity has a respective continuous surface profile solely defined by and inside the thermoplastic layer, the continuous surface profile having a respective bottom wall surface and a respective side wall surface.

14. The core layer of claim 12 wherein each inlay layer comprises a supporting film, and the respective at least one electronic component is embedded or mounted on the supporting film.

15. The core layer of claim 12 wherein the base polymer resin in the crosslinked polymer composition is epoxy or urethane acrylate.

16. The core layer of claim 12 wherein the thermoplastic layer comprises polyvinyl chloride or copolymer of vinyl chloride.

17. The core layer of claim 12 , wherein the crosslinked polymer composition defines a respective portion of the upper surface of the core layer over each respective cavity.

18. The core layer of claim 12 , wherein the crosslinked polymer composition and the thermoplastic layer define the upper surface of the core layer.

Assignees

• X Card Holdings Llc

Inventors

• Cox Mark A

Classifications

• G06K19/07745 Primary

  Mounting details of integrated circuit chips · CPC title

• B32B3/08

  characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} · CPC title

• Y10T428/31667

  Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product · CPC title

• Y10T428/31692

  Next to addition polymer from unsaturated monomers · CPC title

• Y10T428/31511

  Of epoxy ether · CPC title