Smart card module arrangement

Patent metadata

Field	Value
Publication number	US-9633303-B2
Application number	US-201414215229-A
Country	US
Kind code	B2
Filing date	Mar 17, 2014
Priority date	Mar 18, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

In various embodiments, a smart card module arrangement is provided. The smart card module arrangement includes a carrier, in which a depression is formed, a smart card module, which is arranged in the depression, and a smart card antenna. The smart card antenna can be coupled to the smart card module in a contactless manner.

First claim

What is claimed is:

1. A smart card module arrangement, comprising:
a carrier, in which a depression is formed;
a smart card module arranged in the depression; and
a smart card antenna, wherein the smart card antenna is coupled to the smart card module in a contactless manner; wherein the smart card antenna comprises turns disposed on an exterior surface of the carrier.

2. The smart card module arrangement of claim 1 ,
wherein the smart card module comprises:
a smart card module carrier; and
a chip, which is arranged on an upper surface of the smart card module carrier and comprises an integrated circuit.

3. The smart card module arrangement of claim 1 ,
wherein the smart card module furthermore comprises a coil, which is coupled to the integrated circuit.

4. The smart card module arrangement of claim 3 ,
wherein turns of the coil are formed at least one of on the upper surface or at the lower surface of the smart card module carrier.

5. The smart card module arrangement of claim 1 ,
wherein the depression is filled with a material in such a way that the carrier has a planar upper surface.

6. The smart card module arrangement of claim 1 ,
wherein the turns of the smart card antenna are arranged on the surface of the smart card module arrangement toward which the depression is open.

7. The smart card module arrangement of claim 1 ,
wherein the turns of the smart card antenna are arranged at the surface of the smart card module arrangement which is situated opposite the opening of the depression.

8. The smart card module arrangement of claim 1 , further comprising:
a smart card antenna carrier, wherein turns of the smart card antenna are formed at a surface of the smart card antenna carrier.

9. The smart card module arrangement of claim 8 ,
wherein the smart card antenna carrier is formed at the carrier.

10. The smart card module arrangement of claim 8 ,
wherein at least one material layer is arranged between the smart card antenna carrier and the carrier.

11. The smart card module arrangement of claim 1 ,
wherein turns of the smart card antenna run, as viewed from the center of the smart card module arrangement in a radial direction toward the edges of the smart card module arrangement, outside the region of the smart card module.

12. A smart card, comprising:
a smart card module arrangement, comprising:
a carrier, in which a depression is formed;
a smart card module arranged in the depression; and
a smart card antenna, wherein the smart card antenna is coupled to the smart card module in a contactless manner; wherein the smart card antenna comprises turns disposed on an exterior surface of the carrier.

13. The smart card of claim 12 , further comprising:
a contact arrangement, which is provided at a surface of the smart card and is electrically coupled to the smart card module.

14. The smart card of claim 13 ,
wherein the smart card is designed to communicate with a reader by means of the contact arrangement.

15. The smart card of claim 12 ,
wherein the smart card is designed to communicate with a reader in a contactless manner by means of the smart card antenna.

16. The smart card of claim 12 ,
wherein the smart card is designed as a dual interface smart card.

17. A method for producing a smart card module arrangement, the method comprising:
providing a carrier;
forming a depression in the carrier;
arranging a smart card module in the depression; wherein the depression has a depth substantially equivalent to the height of the smart card module; and
forming a smart card antenna, which is coupled to the smart card module in a contactless manner; wherein the smart card antenna comprises turns disposed on an exterior surface of the carrier.

18. The method of claim 17 ,
wherein the smart card module is arranged in the depression in such a way that an upper surface of the smart card module faces a bottom of the depression.

19. The method of claim 17 ,
wherein the smart card module is arranged in the depression in such a way that a lower surface of the smart card module faces the bottom of the depression.

20. The method of claim 17 , further comprising:
filling the depression with a material in such a way that the carrier has a planar upper surface.

21. The method of claim 17 , further comprising:
forming a smart card antenna carrier; and
arranging turns of the smart card antenna at a surface of the smart card antenna carrier.

22. The method of claim 21 , further comprising:
forming at least one material layer between the smart card antenna carrier and the carrier.

23. A method for producing a smart card, the method comprising:
providing a smart card module arrangement, comprising
a carrier, in which a depression is formed;
a smart card module arranged in the depression; wherein the depression has a depth substantially equivalent to the height of the smart card module; and
a smart card antenna, wherein the smart card antenna is coupled to the smart card module in a contactless manner; wherein the smart card antenna comprises turns disposed on an exterior surface of the carrier;

arranging at least one smart card layer at least one of on or below the smart card module arrangement.

Assignees

• Infineon Technologies Ag

Inventors

• Pueschner Frank
• Hoegerl Juergen
• Scherl Peter

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• G06K19/07745 Primary

  Mounting details of integrated circuit chips · CPC title