Tamper-resistant transaction card and method of providing a tamper-resistant transaction card

Patent metadata

Field	Value
Publication number	US-11354554-B2
Application number	US-202117174765-A
Country	US
Kind code	B2
Filing date	Feb 12, 2021
Priority date	Apr 14, 2015
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

A dynamic transaction card that is manufactured using conductive plastic jumpers that will dissolve when in contact with a solvent used to tamper with the dynamic transaction card. Internal components of a dynamic transaction card may be manufactured using a synthetic or semi-synthetic organic material, such as, for example, plastics. These materials may be conductive to provide functionality to a dynamic transaction card, such as a connection between an integrated circuit and other card components such that when the materials dissolve, the connections are broken and the dynamic transaction card may be inactive due to the loss of various connections.

First claim

What is claimed is:

1. A dynamic transaction card comprising:
a microprocessor;
a EuroPay-MasterCard-Visa (EMV) chip; and
a first connector, comprising a first dissolvable material, positioned between the microprocessor and the EMV chip to provide a first electrical connection between the microprocessor and the EMV chip,
wherein, when the first connector is dissolved with a solvent, the first electrical connection between the microprocessor and the EMV chip is interrupted and the dynamic transaction card is deactivated.

2. The dynamic transaction card of claim 1 , wherein the first dissolvable material is an irreversibly cured polymer injected into a mold to form the first connector.

3. The dynamic transaction card of claim 2 , wherein the first connector is manufactured using reaction injection molding.

4. The dynamic transaction card of claim 2 , wherein the irreversibly cured polymer comprises a fiber or mica reinforcing agent.

5. The dynamic transaction card of claim 1 , wherein the first dissolvable material comprises polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbonate/acrylonitrile butadiene styrene.

6. The dynamic transaction card of claim 1 , further comprising:
an outer protective layer covering the first connector, the microprocessor, and the EMV chip,
wherein the outer protective layer comprises a dissolvable material.

7. The dynamic transaction card of claim 1 , further comprising:
a power supply; and
a second connector comprising a second dissolvable material, the second connector positioned between the power supply and the microprocessor to provide a second electrical connection between the power supply and the microprocessor,
wherein, when the second connector is dissolved with the solvent, the second electrical connection between the power supply and the microprocessor is interrupted and the dynamic transaction card is deactivated.

8. The dynamic transaction card of claim 7 , wherein:
the first dissolvable material and the second dissolvable material comprise a first polymer.

9. The dynamic transaction card of claim 7 , wherein:
the first dissolvable material is a first polymer;
the second dissolvable material is a second polymer; and
the first polymer and the second polymer are different polymers.

10. The dynamic transaction card of claim 7 , further comprising:
a bootloader operating an interrogation program; and
a memory;
wherein the first and the second connectors are arranged in a sequence; and
wherein the interrogation program erases the memory when the sequence is broken by either the first connector or the second connector being dissolved.

11. A method of manufacturing a dynamic transaction card, the method comprising:
placing a microprocessor and a EMV chip into a mold;
injecting a first polymer mixture into the mold to create a first dissolvable connector to provide a first electrical connection between the microprocessor and the EMV chip;
curing the first polymer mixture irreversibly in the mold; and
encasing the microprocessor, the EMV chip, and the first dissolvable connector between two outer layers to form the dynamic transaction card,
wherein, when the first dissolvable connector is dissolved with a solvent, the first electrical connection between the microprocessor and the EMV chip is interrupted and the dynamic transaction card is deactivated.

12. The method of claim 11 , wherein the first dissolvable connector is manufactured using reaction injection molding.

13. The method of claim 11 , wherein the first polymer mixture comprises a fiber or mica reinforcing agent.

14. The method of claim 11 , wherein the first polymer mixture comprises polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbonate/acrylonitrile butadiene styrene.

15. The method of claim 11 , wherein:
the two outer layers comprise a second polymer mixture dissolvable by the solvent.

16. The method of claim 11 , further comprising:
placing a power supply into the mold; and
injecting a second polymer mixture into the mold to create a second dissolvable connector to provide a second electrical connection between the power supply and the microprocessor.

17. The method of claim 16 , wherein, when the second dissolvable connector is dissolved with the solvent, the second electrical connection between the microprocessor and the power supply is interrupted and the dynamic transaction card is deactivated.

18. The method of claim 16 , wherein:
the first polymer mixture and the second polymer mixture comprise a first polymer.

19. The method of claim 16 , wherein:
the first polymer mixture comprises a first polymer;
the second polymer mixture comprises a second polymer; and
the first polymer and the second polymer are different polymers.

20. The method of claim 16 , further comprising:
installing a bootloader on the microprocessor, the bootloader operating an interrogation program; and
encasing a memory between the two outer layers;
wherein the first and the second dissolvable connectors are arranged in a sequence; and
wherein the interrogation program erases the memory when the sequence is broken by either the first dissolvable connector or the second dissolvable connector being dissolved.

Assignees

• Capital One Services Llc

Inventors

• Wurmfeld David
• ZARAKAS James
• Markson Theodore
• SANGI Saleem
• LOCKE Tyler
• Kelly Kevin P

Classifications

• G06K19/07381 Primary

  with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering · CPC title

• G06F21/87

  by means of encapsulation, e.g. for integrated circuits · CPC title

• G06K19/07743

  External electrical contacts · CPC title

• G06F21/77

  in smart cards · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title