Tamper-resistant transaction card and method of providing a tamper-resistant transaction card

Patent metadata

Field	Value
Publication number	US-10089569-B2
Application number	US-201715624929-A
Country	US
Kind code	B2
Filing date	Jun 16, 2017
Priority date	Apr 14, 2015
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A dynamic transaction card that is manufactured using conductive plastic jumpers that will dissolve when in contact with a solvent used to tamper with the dynamic transaction card. Internal components of a dynamic transaction card may be manufactured using a synthetic or semi-synthetic organic material, such as, for example, plastics. These materials may be conductive to provide functionality to a dynamic transaction card, such as a connection between an integrated circuit and other card components such that when the materials dissolve, the connections are broken and the dynamic transaction card may be inactive due to the loss of various connections.

First claim

The invention claimed is:

1. A transaction card comprising:
an outer layer comprising a plastic material;
two or more electrical components, including a microprocessor and an EMV chip;
at least one connector providing an electrical connection between the microprocessor and EMV chip, wherein:
the at least one connector is constructed from a conductive, dissolvable material being configured to be dissolved by a solvent effective for dissolving the outer layer; further wherein
dissolving of the at least one connector breaks the connection between the microprocessor and EMV chip such that the transaction card is deactivated.

2. The dynamic transaction card of claim 1 , wherein the two or more electrical components comprise an integrated circuit, power supply, power management component, and/or a microcontroller.

3. The transaction card of claim 2 , wherein a second connector of the at least one connector connects the integrated circuit to the power supply or to the power management component.

4. The transaction card of claim 2 , wherein a third connector of the at least one connector connects the microprocessor or the microcontroller to the power supply, and/or wherein the third connector connects the microprocessor or the microcontroller to the power management component.

5. The transaction card of claim 1 , wherein the plastic material comprises polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbonate/acrylonitrile butadiene styrene.

6. The transaction card of claim 1 , wherein the plastic material is configured to be irreversibly cured based on a mixed polymer injection during manufacture.

7. The transaction card of claim 6 , wherein the at least one connector is manufactured using reaction injection molding.

8. The transaction card of claim 6 , wherein the mixed polymer includes added reinforcing agents.

9. The transaction card of claim 8 , wherein the reinforcing agents comprise fiber and/or mica.

10. The transaction card of claim 1 , further comprising a backing layer, wherein the backing layer and the outer layer are molded together.

11. The transaction card of claim 10 , wherein the backing layer comprises a plastic material.

12. The transaction card of claim 1 , wherein the at least one connector is x-ray transparent.

13. A method of manufacturing a transaction card:
providing an outer layer comprising a plastic material;
providing two or more electrical components, including a microprocessor and an EMV chip;
providing an electrical connection between the microprocessor and EMV chip by at least one connector, wherein:
the at least one connector is constructed from a conductive, dissolvable material being configured to be dissolved by a solvent effective for dissolving the outer layer; further wherein
dissolving of the at least one connector breaks the connection between the microprocessor and EMV chip such that the transaction card is deactivated.

14. The method of manufacturing a transaction card of claim 13 , wherein the two or more electrical components comprise an integrated circuit, power supply, power management component, and/or a microcontroller.

15. The method of manufacturing a transaction card of claim 14 , wherein a second connector of the at least one connector connects the integrated circuit to the power supply or to the power management component.

16. The method of manufacturing a transaction card of claim 14 , wherein a third connector of the at least one connector connects the microprocessor or the microcontroller to the power supply, and/or wherein the third connector connects the microprocessor or the microcontroller to the power management component.

17. The method of manufacturing a transaction card of claim 13 , wherein the plastic material comprises polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbonate/acrylonitrile butadiene styrene.

18. The method of manufacturing a transaction card of claim 13 , wherein the plastic material is configured to be irreversibly cured based on a mixed polymer injection during manufacture.

19. The method of manufacturing a transaction card of claim 18 , wherein the at least one connector is manufactured using reaction injection molding.

20. The method of manufacturing a transaction card of claim 18 , wherein the mixed polymer includes added reinforcing agents.

Assignees

• Capital One Services Llc
• Capital One Services Llc

Inventors

• Wurmfeld David
• ZARAKAS James
• Markson Theodore
• SANGI Saleem
• LOCKE Tyler
• Kelly Kevin

Classifications

• G06K19/07743

  External electrical contacts · CPC title

• G06F21/77

  in smart cards · CPC title

• G06K19/07372

  by detecting tampering with the circuit · CPC title

• G06F21/87

  by means of encapsulation, e.g. for integrated circuits · CPC title

• G06K19/07381 Primary

  with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering · CPC title