Bonding materials of dissimilar coefficients of thermal expansion

Patent metadata

Field	Value
Publication number	US-11353602-B2
Application number	US-201916690853-A
Country	US
Kind code	B2
Filing date	Nov 21, 2019
Priority date	Jul 5, 2016
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer.

First claim

What is claimed is:

1. A system comprising:
a first layer,
a second layer with a temperature driver therein,
a controller comprising a processor and a memory, the memory having a program stored therein, the processor configured to control powers to the temperature driver by executing the program;
wherein the program, when executed, causes the processor to set powers to the temperature driver such that relative thermal expansions of the first layer and the second layer are essentially the same at all time during a process of bonding the first layer and the second layer.

2. The system of claim 1 , wherein the first layer is an X-ray absorption layer configured to absorb X-ray photons; wherein the second layer is an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons.

3. The system of claim 1 , further comprising a support; wherein the second layer is mounted to the support and the controller controls the powers to the temperature driver through an electrical contact on the support.

4. The system of claim 1 , wherein the second layer comprises a temperature sensor.

5. The system of claim 4 , wherein the controller reads temperature of the second layer from the temperature sensor and controls the powers to the temperature driver in the second layer based on the temperature read from the temperature sensor.

Assignees

• Shenzhen Xpectvision Tech Co Ltd

Inventors

• Cao Peiyan
• Liu Yurun

Classifications

• H10P90/1914

  using bonding · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• H10F39/189

  X-ray, gamma-ray or corpuscular radiation imagers · CPC title

• A61B6/4241

  using energy resolving detectors, e.g. photon counting · CPC title