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US-2020020881-A1 · Jan 16, 2020 · US
Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
US11345784B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11345784-B2 |
| Application number | US-201917291533-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 6, 2019 |
| Priority date | Nov 9, 2018 |
| Publication date | May 31, 2022 |
| Grant date | May 31, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
First claim
Opening claim text (preview).
The invention claimed is: 1. A resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), wherein the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.5 parts by mass or more and 9.5 parts by mass or less based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C). 2. The resin composition according to claim 1 , wherein the curing agent (C) contains an isocyanate compound (C-2), and a content of the isocyanate compound (C-2) is less than 45 parts by mass based on 100 parts by mass of the polyrotaxane (A). 3. The resin composition according to claim 1 , wherein the curing agent (C) contains 30% by mass or more of a monofunctional acid anhydride. 4. The resin composition according to claim 3 , wherein a molar ratio of the monofunctional acid anhydride to a hydroxyl group derived from the polyrotaxane (A) is in a range of 0.01 to 0.8. 5. The resin composition according to claim 3 , wherein a molar ratio of the monofunctional acid anhydride to an epoxy group of the epoxy resin (B) is in a range of 0.01 to 1.1. 6. The resin composition according to claim 3 , wherein the monofunctional acid anhydride is an alicyclic compound. 7. The resin composition according to claim 1 , containing 40 to 89.9 parts by mass of the polyrotaxane (A), 10 to 59.9 parts by mass of the epoxy resin (B), and 0.1 parts by mass to 10 parts by mass or less of the curing agent (C), based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C). 8. The resin composition according to claim 1 , further containing a color material (D). 9. A resin film comprising a resin layer containing a dried or partially-cured product of the resin composition according to claim 1 , and a film-supporting base material. 10. A metal foil with resin, comprising a resin layer containing a dried or partially-cured product of the resin composition according to claim 1 , and a metal foil. 11. A metal clad laminate comprising an insulating layer containing a cured product of the resin composition according to claim 1 , and a metal foil. 12. A wiring board having an insulating layer containing a cured product of the resin composition according to claim 1 , and conductor wiring. 13. A circuit mount component in which an electronic component is mounted on the wiring board according to claim 12 .
Assignees
Inventors
Classifications
by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title
Isocyanates; Thioisocyanates · CPC title
consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title
containing nitrogen · CPC title
Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title
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Frequently asked questions
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- What does patent US11345784B2 cover?
- One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08G83/007. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 31 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).