Resin composition for forming varistor and varistor

US11339269B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11339269-B2
Application numberUS-201816770699-A
CountryUS
Kind codeB2
Filing dateDec 4, 2018
Priority dateDec 12, 2017
Publication dateMay 24, 2022
Grant dateMay 24, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant. The (C) carbon nanotubes may be single-walled carbon nanotubes, multi-walled carbon nanotubes, or a combination thereof. The (D) dispersant includes a polyalkyl oxide surfactant. The polyalkyl oxide surfactant has a polyalkyl ether skeleton in the molecule.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition for forming a varistor comprising: (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant, wherein the carbon nanotubes (C) comprise isolated single-walled semiconducting carbon nanotubes. 2. The resin composition for forming a varistor according to claim 1 , wherein the epoxy resin (A) comprises at least one selected from the group consisting of bisphenol A epoxy resins, brominated bisphenol A epoxy resins, bisphenol F epoxy resins, aminophenol epoxy resins, biphenyl epoxy resins, novolak epoxy resins, alicyclic epoxy resins, naphthalene epoxy resins, ether epoxy resins, polyether epoxy resins and silicone epoxy copolymer resins. 3. The resin composition for forming a varistor according to claim 1 , wherein the curing agent (B) comprises at least one selected from the group consisting of amine compounds, phenols, acid anhydrides and imidazole compounds. 4. The resin composition for forming a varistor according to claim 1 , wherein the carbon nanotubes (C) further comprise multi-walled carbon nanotubes. 5. The resin composition for forming a varistor according to claim 1 , wherein the carbon nanotubes (C) consist of isolated single-walled semiconducting carbon nanotubes. 6. The resin composition for forming a varistor according to claim 1 , wherein the resin composition includes the carbon nanotubes (C) in an amount of 0.05 to 2 parts by weight with respect to 100 parts by weight of the epoxy resin (A). 7. The resin composition for forming a varistor according to claim 1 , wherein the dispersant (D) comprises at least one selected from the group consisting of anionic surfactants, cationic surfactants, amphoteric surfactants, nonionic surfactants, hydrocarbon surfactants, fluorine surfactants, silicon surfactants, polycarboxylic acids, polyether carboxylic acids, polycarboxylic acid salts, alkylsulfonic acid salts, alkylbenzenesulfonic acid salts, alkyl ether sulfonic acid salts, aromatic polymers, organic conductive polymers, polyalkyl oxide surfactants, inorganic salts, organic acid salts and aliphatic alcohols. 8. The resin composition for forming a varistor according to claim 7 , wherein the dispersant (D) comprises a polyalkyl oxide surfactant, and the polyalkyl oxide surfactant has a polyalkyl ether skeleton in the molecule. 9. A varistor comprising a cured product of the resin composition for forming a varistor according to claim 1 .

Assignees

Inventors

Classifications

  • Varistor boundary, e.g. surface layers (H01C7/12 takes precedence) · CPC title

  • voltage responsive, i.e. varistors · CPC title

  • Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

  • C08K3/041Primary

    Carbon nanotubes · CPC title

  • Varistor cores (H01C7/12 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11339269B2 cover?
Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant. The (C) carbon nanotubes may be single-walled carbon nanotubes, multi-walled carbon nanotubes, or a combinat…
Who is the assignee on this patent?
Namics Corp
What technology area does this patent fall under?
Primary CPC classification C08K3/041. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 24 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).