Systems and methods for bonding electronic components on substrates with rough surfaces

Patent metadata

Field	Value
Publication number	US-11337312-B2
Application number	US-202017014111-A
Country	US
Kind code	B2
Filing date	Sep 8, 2020
Priority date	Sep 8, 2020
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

First claim

What is claimed is:

1. A method for bonding an electronic component to a substrate with a rough surface, comprising:
disposing an insulating adhesive on the substrate;
applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate;
curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed;
disposing at least one trace on the planar smooth surface of the pad;
depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace;
placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and
bonding the electronic component to the substrate by curing the anisotropic conductive material.

2. The method according to claim 1 , wherein the substrate comprises a textile substrate.

3. The method according to claim 2 , wherein the textile substrate comprises a woven fabric comprising the at least one opening.

4. The method according to claim 1 , wherein the insulating adhesive comprises an epoxy.

5. The method according to claim 1 , wherein the pad is a rigid or semi-rigid structure having a size and shape selected so that a flexibility of the substrate is unaffected by the pad.

6. The method according to claim 1 , wherein the planar smooth surface of the pad is absent of any openings.

7. The method according to claim 1 , wherein the electronic component is formed on a die of semiconducting material, and the die is bonded to the substrate via the anisotropic conductive material.

8. The method according to claim 1 , wherein the electronic component is formed on a die of semiconducting material that is packaged as a chip, and the chip is bonded to the substrate via the anisotropic conductive material.

9. The method according to claim 1 , wherein the anisotropic conductive material comprises an Anisotropic Conductive Paste (ACP) or an Anisotropic Conductive Film (ACF).

10. The method according to claim 1 , further comprising validating proper operation of an electronic device comprising the electronic component prior to curing the anisotropic conductive material.

11. The method according to claim 1 , further comprising coating the electronic component with a flexible fluid resistive material subsequent to being bonded to the substrate.

12. The method according to claim 1 , wherein the electronic component is electrical coupled to the at least one trace at the same time the electronic component is bonded to the substrate.

13. An electronic device, comprising:
a substrate with a rough surface;
a pad integrated with the substrate, the pad being formed of a cured insulating adhesive that is at least partially embedded in the substrate;
at least one trace disposed on a planar smooth surface of the pad;
an anisotropic conductive material deposited on the planar smooth surface of the pad so as to at least cover the at least one trace; and
an electronic component bonded to the pad via the anisotropic conductive material which has been cured;
wherein the anisotropic conductive material facilitates an electrical coupling between the electronic component and the at least one trace.

14. The electronic device according to claim 13 , wherein the substrate comprises a woven fabric comprising at least one opening.

15. The electronic device according to claim 13 , wherein the insulating adhesive comprises an epoxy.

16. The electronic device according to claim 13 , wherein the pad is a rigid or semi-rigid structure having a size and shape selected so that a flexibility of the substrate is unaffected by the pad.

17. The electronic device according to claim 13 , wherein the planar smooth surface of the pad is absent of any openings.

18. The electronic device according to claim 13 , wherein the electronic component is formed on a die of semiconducting material, and the die is bonded to the substrate via the anisotropic conductive material.

19. The electronic device according to claim 13 , wherein the electronic component is formed on a die of semiconducting material that is packaged as a chip, and the chip is bonded to the substrate via the anisotropic conductive material.

20. The electronic device according to claim 13 , wherein the anisotropic conductive material comprises an Anisotropic Conductive Paste (ACP) or an Anisotropic Conductive Film (ACF).

21. The electronic device according to claim 13 , wherein proper operation of the electronic device is validated prior to when the anisotropic conductive material is cured.

22. The electronic device according to claim 13 , further comprising a flexible fluid resistive material coating the electronic component.

23. The electronic device according to claim 13 , wherein the electronic device comprises an environmental sensor or a health monitor.

24. A textile product, comprising:
a piece of fabric;
a pad integrated with the piece of fabric, the pad being formed of a cured insulating adhesive that is at least partially embedded in the piece of fabric;
at least one trace disposed on a planar smooth surface of the pad;
an anisotropic conductive material deposited on the planar smooth surface of the pad so as to at least cover the at least one trace; and
an environmental sensor or health monitor bonded to the pad via the anisotropic conductive material which has been cured.

25. The textile product according to claim 24 , wherein the insulating adhesive comprises an epoxy.

26. The textile product according to claim 24 , wherein the pad is a rigid or semi-rigid structure having a size and shape selected so that a flexibility of the fabric is unaffected by the pad.

27. The textile product according to claim 24 , wherein the fabric comprises a woven fabric with a plurality of openings.

28. The textile product according to claim 27 , wherein the planar smooth surface of the pad is absent of any openings.

29. The textile product according to claim 24 , wherein the anisotropic conductive material comprises an Anisotropic Conductive Paste (ACP) or an Anisotropic Conductive Film (ACF).

Assignees

• Palo Alto Res Ct Inc

Inventors

• Mei Ping

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title