Fabric with embedded electrical components

Patent metadata

Field	Value
Publication number	US-10910315-B2
Application number	US-201615752476-A
Country	US
Kind code	B2
Filing date	Aug 10, 2016
Priority date	Aug 20, 2015
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

A fabric-based item may include fabric such as woven fabric having insulating and conductive yarns or other strands of material. The conductive yarns may form signal paths. Electrical components can be embedded within pockets in the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The electrical device may be a light-emitting diode, a sensor, an actuator, or other electrical device. The electrical device may have contacts that are soldered to contacts on the interposer. The interposer may have additional contacts that are soldered to the signal paths. The fabric may have portions that form transparent windows overlapping the electrical components or that have other desired attributes.

First claim

What is claimed is:

1. A fabric-based item comprising:
fabric having a pocket and having conductive paths; and
an electrical component embedded in the pocket, wherein the electrical component comprises an electronic device and an interposer comprising a substrate with opposing first and second surfaces, wherein the electronic device is mounted on the first surface of the substrate, and wherein the interposer further has pads on the first surface of the substrate that are coupled to the conductive paths.

2. The fabric-based item defined in claim 1 wherein the pads comprise solder pads and wherein the solder pads are soldered to the conductive paths.

3. The fabric-based item defined in claim 2 wherein the fabric has opaque yarns and has transparent yarns that are patterned to form a transparent window in the fabric that is aligned with the electrical component.

4. The fabric-based item defined in claim 3 wherein the electrical device is soldered to the interposer.

5. The fabric-based item defined in claim 4 wherein the electrical device comprises a semiconductor die.

6. The fabric-based item defined in claim 5 wherein the conductive paths comprise conductive yarns.

7. The fabric-based item defined in claim 6 wherein the interposer has first solder pads that are soldered to the solder pads of the electrical component and has second solder pads that are soldered to the conductive yarns.

8. The fabric-based item defined in claim 7 wherein the electrical device comprises a light-emitting diode.

9. The fabric-based item defined in claim 1 wherein the electrical device is a semiconductor die.

10. The fabric-based item defined in claim 1 wherein the electrical device comprises an actuator.

11. The fabric-based item defined in claim 1 wherein the electrical device comprises a sensor.

12. The fabric-based item defined in claim 1 , wherein the substrate is a flexible printed circuit substrate having a main portion and a serpentine arm that extends from the main portion, wherein a first pad is coupled to the electronic device and is on the main portion adjacent to a first end of the serpentine arm, and wherein a second pad is coupled to one of the conductive paths and is on an opposing second end of the serpentine arm.

13. A fabric-based item comprising:
fabric having a pocket and having conductive paths; and
an electrical component that is mounted in the pocket in the fabric, wherein the electrical component comprises an electrical device that has contact pads and that is mounted on an interposer, wherein the interposer has first pads that are coupled to the conductive paths and has second pads that are coupled to the contact pads of the electrical device, and wherein the first pads and the second pads are on a same surface of the interposer.

14. The fabric-based item defined in claim 13 wherein the first pads comprise first solder pads that are soldered to the conductive paths and wherein the second pads comprise second solder pads that are soldered to the contact pads.

15. The fabric-based item defined in claim 13 wherein the electrical device comprises an actuator.

16. The fabric-based item defined in claim 13 wherein the electrical device comprises a sensor.

17. The fabric-based item defined in claim 13 wherein the electrical device comprises a semiconductor die.

18. The fabric-based item defined in claim 13 , wherein the interposer comprises a flexible printed circuit substrate having a main portion and a serpentine arm that extends from the main portion, wherein one of the second pads is on the main portion adjacent to a first end of the serpentine arm, and wherein one of the first pads is on an opposing second end of the serpentine arm.

Assignees

• Apple Inc

Inventors

• Sunshine Daniel D
• Drzaic Paul S
• Podhajny Daniel A
• Kindlon David M
• Kim Hoon Sik
• Crews Kathryn P
• Hsu Yung-Yu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title

• H10H29/857

  Interconnections (of active-matrix LED displays H10H29/49) · CPC title