Antenna boards and communication devices

Patent metadata

Field	Value
Publication number	US-11336015-B2
Application number	US-201815939180-A
Country	US
Kind code	B2
Filing date	Mar 28, 2018
Priority date	Mar 28, 2018
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.

First claim

The invention claimed is:

1. An antenna board, comprising:
a substrate including an antenna feed structure;
an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and
an air cavity between the antenna patch and the substrate,
wherein:
the antenna patch is disposed over a recess in the substrate and wherein a bottom of the recess includes a ground plane, and
the ground plane is a continuous ground plane at a surface of the bottom of the recess.

2. The antenna board of claim 1 , wherein the antenna patch is a first antenna patch, the antenna board further includes a second antenna patch, and the first antenna patch is between the substrate and the second antenna patch.

3. The antenna board of claim 2 , further comprising:
a patch board having a first face and an opposing second face;
wherein the first antenna patch is coupled to the first face of the patch board, and the second antenna patch is coupled to the second face of the patch board.

4. The antenna board of claim 3 , wherein the patch board is coupled to the substrate by an adhesive.

5. The antenna board of claim 2 , wherein the air cavity is a first air cavity, the antenna board further includes a second air cavity, and the second air cavity is between the first antenna patch and the second antenna patch.

6. The antenna board of claim 5 , further comprising:
a patch board having a first face and an opposing second face;
wherein the first antenna patch is coupled to the first face of the patch board, the second antenna patch is coupled to the second face of the patch board, and the patch board includes the second air cavity.

7. The antenna board of claim 6 , wherein the patch board includes at least one opening in the second face.

8. The antenna board of claim 7 , wherein the at least one opening is an air cavity between a portion of the patch board to which the first antenna patch is coupled and a portion of the patch board to which the second antenna patch is coupled.

9. The antenna board of claim 2 , further comprising:
a first patch board having a first face and an opposing second face;
a second patch board having a first face and an opposing second face;
conductive contacts at the first face of the second patch board; and
conductive contacts at a surface of the substrate,
wherein:
the first face of the first patch board is closer to the bottom of the recess than the second face of the first patch board,
the first antenna patch is coupled to the second face of the first patch board,
the second antenna patch is coupled to the first face of the second patch board, and
the conductive contacts at the first face of the second patch board are coupled to the conductive contacts at the surface of the substrate.

10. The antenna board of claim 1 , wherein the antenna feed structure is a stripline feed structure.

11. The antenna board of claim 1 , wherein the substrate has a thickness between 300 microns and 800 microns.

12. The antenna board of claim 1 , wherein the first face of the first patch board is suspended over the recess and over the substrate.

13. The antenna board of claim 12 , wherein the air cavity is a first air cavity, the antenna board further includes a second air cavity, and the second air cavity is between the first antenna patch and the second antenna patch.

14. An antenna module, comprising:
an integrated circuit (IC) package; and
an antenna board, wherein the antenna board is coupled to the IC package, and the antenna board includes:
a substrate including an antenna feed structure,
an antenna patch, wherein the antenna patch is a millimeter wave antenna patch, and
an air cavity between the antenna patch and the substrate,
wherein:
the antenna patch is disposed over a recess in the substrate,
a bottom of the recess includes a ground plane, and
the ground plane is a continuous ground plane at a surface of the bottom of the recess.

15. The antenna module of claim 14 , wherein the IC package includes a radio frequency (RF) communication die.

16. The antenna module of claim 14 , wherein the antenna patch is coupled to a patch board by an adhesive, the patch board being disposed over the recess in the substrate.

17. A communication device, comprising:
a housing; and
an antenna board in the housing, wherein the antenna board includes:
a substrate including an antenna feed structure,
an antenna patch, wherein the antenna patch is a millimeter wave antenna patch, and
an air cavity between the antenna patch and the substrate,
wherein:
the antenna patch is disposed over a recess in the substrate,
a bottom of the recess includes a ground plane, and
the ground plane is a continuous ground plane at a surface of the bottom of the recess.

18. The communication device of claim 17 , wherein the communication device is a handheld communication device.

19. The communication device of claim 17 , further comprising a display.

20. The communication device of claim 17 , wherein the housing includes a metal chassis having an opening, and the antenna patch is proximate to the opening.

Assignees

• Intel Ip Corp
• Intel Corp

Inventors

• Thai Trang
• Dalmia Sidharth

Classifications

• H01Q21/0068

  Dielectric waveguide fed arrays · CPC title

• H01Q19/138

  Parallel-plate feeds, e.g. pill-box, cheese aerials · CPC title

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q9/0414 Primary

  in a stacked or folded configuration · CPC title