Printed wiring board production method and printed wiring board production apparatus

Patent metadata

Field	Value
Publication number	US-11330718-B2
Application number	US-201816621447-A
Country	US
Kind code	B2
Filing date	May 21, 2018
Priority date	Jul 26, 2017
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

First claim

The invention claimed is:

1. A printed wiring board production apparatus that forms a conductive pattern on a base film by an additive method or a subtractive method, comprising:
a plating solution storage tank;
a substrate fixing mechanism configured to fix a printed wiring board substrate that is a target to be plated;
an anode arranged to oppose the printed wiring board substrate;
a shield plate arranged between the printed wiring board substrate and the anode;
an anode shield plate arranged between the shield plate and the anode, so as not to make contact with the shield plate nor the anode, and
a voltage applying mechanism configured to apply a voltage to the anode and the printed wiring board substrate that forms a cathode,
wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater but 150 mm or less,
wherein a distance between the anode shield plate and the printed wiring board substrate is 100 mm or greater but 300 mm or less,
wherein the shield plate includes an opening region opposing the printed wiring board substrate in a plan view, and shield plate openings formed in an array within the opening region,
wherein the opening region includes a central opening region at a center portion of the opening region, and a pair of end opening regions at end portions on opposite ends of the central opening region, and
wherein an opening ratio of each of the pair of end opening regions is higher than the opening ratio of the central opening region.

2. The printed wiring board production apparatus as claimed in claim 1 , wherein the plating solution storage tank includes a shield plate fixing mechanism configured to fix the shield plate.

3. The printed wiring board production apparatus as claimed in claim 1 , wherein
an opening ratio of the central opening region of the opening region is 10% or higher but 50% or lower.

4. The printed wiring board production apparatus as claimed in claim 1 , wherein an external size of the shield plate is larger than an external size of the printed wiring board substrate in a plan view.

5. The printed wiring board production apparatus as claimed in claim 1 , wherein
the anode shield plate includes a plurality of anode shield plate openings, and
an area of the anode shield plate, including the plurality of anode shield plate openings, is larger than an immersion area of the anode into a plating solution stored in the plating solution storage tank during the plating process.

6. The printed wiring board production apparatus as claimed in claim 1 , wherein the shield plate, in a front view of the anode, includes
a frame shaped region having an external size exceeding an external size of the printed circuit board substrate,
the central opening region, located at a center on an inner side of the frame shaped region, and
the pair of end opening regions located at an upper end and a lower end of the central opening region, respectively, on the inner side of the frame shaped region,
wherein the frame shaped region completely surrounds the central opening region and the pair of end opening regions.

7. The printed wiring board production apparatus as claimed in claim 1 , wherein the anode shield plate includes a plurality of anode shield plate openings.

8. The printed wiring board production apparatus as claimed in claim 1 , wherein
an opening ratio of the central opening region of the opening region is 10% or higher but 50% or lower, and
an opening ratio of each of the pair of end opening regions of the opening region is 101% or higher but 110% or lower.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Motomura Junichi
• Nitta Koji
• Sakai Shoichiro
• Takahashi Kenji
• IKEBE Maki
• Miura Kousuke
• Itoh Masahiro

Classifications

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• C25D17/008

  Current shielding devices · CPC title

• H05K3/18 Primary

  using precipitation techniques to apply the conductive material · CPC title

• H05K3/241

  characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title