Current-perpendicular-to-plane giant magnetoresistive element, precursor thereof, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11328743-B2
Application number	US-201917040645-A
Country	US
Kind code	B2
Filing date	Feb 26, 2019
Priority date	Apr 4, 2018
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

Provided is a precursor of a current-perpendicular-to-plane giant magnetoresistive element having a laminated structure of ferromagnetic metal layer/nonmagnetic metal layer/ferromagnetic metal layer, the precursor having a nonmagnetic intermediate layer containing a non-magnetic metal and an oxide in a predetermined ratio such that the distribution thereof is nearly uniform at the atomic level. Also provided is a current-perpendicular-to-plane giant magnetoresistive element having a current-confinement structure (CCP) which has: a current confinement structure region made of a conductive alloy and obtained by heat-treating a laminated structure of a ferromagnetic metal layer and a nonmagnetic intermediate layer at a predetermined temperature; and a high-resistance metal alloy region containing an oxide and surrounding the current confinement structure region.

First claim

The invention claimed is:

1. A precursor of a current-perpendicular-to-plane giant magnetoresistance element having a precursor laminate structure of a ferromagnetic metal layer/a non-magnetic metal layer/a ferromagnetic metal layer, comprising:
a non-magnetic spacer layer containing a non-magnetic metal and an oxide at a predetermined ratio and containing the non-magnetic metal and the oxide in a roughly uniform manner at an atomic level,
wherein the oxide is at least one substance selected from among In 2 O 3 , SnO 2 , Ga 2 O 3 , and a mixture thereof.

2. The precursor of a current-perpendicular-to-plane giant magnetoresistance element according to claim 1 , wherein
the non-magnetic metal is Ag,
the oxide is InZnO (a mixture of In 2 O 3 and ZnO), and
the precursor of a current-perpendicular-to-plane giant magnetoresistance element comprises the non-magnetic spacer layer consisting of a AgInZnO single-layer structure or a AgInZnO/InZnO laminate structure.

3. A current-perpendicular-to-plane giant magnetoresistance element, wherein a current-confined-path (CCP) is formed from the precursor of a current-perpendicular-to-plane giant magnetoresistance element according to claim 2 , is formed by performing a heat treatment at a predetermined temperature on the precursor laminate structure in which the ferromagnetic metal layers are CoMnFeGe and the non-magnetic spacer layer is AgInZnO, through a redox reaction between an element constituting the ferromagnetic metal layers and an oxide constituting the precursor, and has a current-confined-path region consisting of AgIn and a high-resistance region containing (Mn, Zn)O formed so as to surround the current-confined-path region.

4. The current-perpendicular-to-plane giant magnetoresistance element according to claim 3 , wherein composition ranges of the AgIn, the (Mn, Zn)O, and the CoMnFeGe are the following ranges:
Ag 100-x In x (x=1 to 80 at. %);
(Mn 1-x Zn x ) 100-y O y (x=0 to 0.5, y=20 to 80 at. %); and
Co 35-60 Mn 0-30 Fe 0-30 Ge 20-40 at. % (but the Mn and the Fe shall not be 0 at. % simultaneously).

5. The current-perpendicular-to-plane giant magnetoresistance element according to claim 3 , wherein areas of the current-confined-path region and the high-resistance region in the current-confined-path are such that a ratio of the area of the current-confined-path region is 1% or more and 50% or less.

6. The current-perpendicular-to-plane giant magnetoresistance element according to claim 3 , wherein the current-perpendicular-to-plane giant magnetoresistance element has
a magnetoresistance (MR) ratio of 50% or more, and
a resistance-area product (RA) of 0.03 Ωμm 2 or more and 0.2 Ωμm 2 or less.

7. The current-perpendicular-to-plane giant magnetoresistance element according to claim 3 , comprising:
a substrate being a silicon substrate, an AlTiC ceramic substrate, or a MgO substrate; and
an underlayer laminated on the substrate,
wherein a first of the ferromagnetic metal layers of the precursor laminate structure forms a lower ferromagnetic layer, a second of the ferromagnetic metal layers of the precursor laminate structure forms an upper ferromagnetic layer, and
wherein the lower ferromagnetic layer and the upper ferromagnetic layer consist of a Co-base Heusler alloy and are laminated on the substrate, and
wherein the non-magnetic spacer layer includes the current-confined-path and is provided between the lower ferromagnetic layer and the upper ferromagnetic layer.

8. The current-perpendicular-to-plane giant magnetoresistance element according to claim 7 , wherein the underlayer consists of at least one substance selected from the group consisting of Cu, Ag, Cr, W, Mo, Au, Pt, Pd, Rh, Ta, Ru, and NiFe.

9. The current-perpendicular-to-plane giant magnetoresistance element according to claim 3 , comprising:
a substrate being a silicon substrate, an AITiC ceramic substrate, or a monocrystalline MgO substrate;
an underlayer laminated on the substrate; and
a spin valve structure laminated on the substrate,
wherein the spin valve structure consists of:
an antiferromagnetic layer,
a ferromagnetic layer (pinned layer),
a Ru coupling layer,
a ferromagnetic layer (reference layer) formed from a first of the ferromagnetic metal layers of the precursor laminate structure,
a non-magnetic layer formed from the non-magnetic metal layer of the precursor laminate structure,
a ferromagnetic layer (free layer) formed from a second of the ferromagnetic metal layers of the precursor laminate structure, and
a protection layer,
wherein the ferromagnetic layer (reference layer) is a lower ferromagnetic layer and the ferromagnetic layer (free layer) is an upper ferromagnetic layer,
wherein the lower ferromagnetic layer and the upper ferromagnetic layer consist of a Co-base Heusler alloy and are laminated on the substrate, and
wherein the non-magnetic spacer layer includes the current-confined-path and is provided between the lower ferromagnetic layer and the upper ferromagnetic layer as the non-magnetic layer of the spin valve structure.

10. A read head to be used on a storage element, the read head using the current-perpendicular-to-plane giant magnetoresistance element according to claim 3 .

11. A magnetic sensor using the current-perpendicular-to-plane giant magnetoresistance element according to claim 3 .

12. A magnetic memory using the current-perpendicular-to-plane giant magnetoresistance element according to claim 3 .

13. The precursor of a current-perpendicular-to-plane giant magnetoresistance element according to claim 1 , wherein
with an additional element denoted as X, at least one of the ferromagnetic metal layers of the precursor laminate structure consists of
a CoFeX (where X is an element selected from among Mg, Ti, V, Cr, and Mn) alloy, or
a Heusler alloy selected from the group consisting of
CoMnZX (where Z is an element selected from among Al, Si, Ga, and Ge, and X is an element selected from among Mg, Ti, V, and Cr),
CoMnFeZX (where Z is an element selected from among Al, Si, Ga, and Ge, and X is an element selected from among Mg, Ti, V, and Cr), and
CoFeZX (where Z is an element selected from among Al, Si, Ga, and Ge, and X is an element selected from among Mg, Ti, V, and Cr).

14. A method of manufacturing a current-perpendicular-to-plane giant magnetoresistance element, comprising steps of:
cleaning a surface of a monocrystalline MgO substrate;
cleaning the monocrystalline MgO substrate by heating at a substrate temperature of 300° C. or higher;
forming an underlayer on the monocrystalline MgO substrate cleaned by the heating, the underlayer being formed at the substrate temperature;
forming a giant magnetoresistance effect layer on the monocrystalline MgO substrate on which a non-magnetic conductive film is formed, the giant magnetoresistance effect layer having a lower ferromagnetic material layer, a non-magnetic spacer layer, and an upper ferromagnetic material layer in this order, the non-magnetic spacer layer being a metal and an oxide sputtered simultaneously to form a precursor of the current-perpendicular-to-plane giant magnetoresistance element; and
performing a heat treatment on the precursor of the current-perpendicular-to-plane giant magnetoresistance element at 250° C. or higher and 400° C. or lower.

Assignees

• Nat Inst Materials Science

Inventors

• Nakatani Tomoya
• Sasaki Taisuke
• Furubayashi Takao
• Hono Kazuhiro

Classifications

• H10N50/85

  Materials of the active region · CPC title

• G11B5/3903

  using magnetic thin film layers or their effects, the films being part of integrated structures · CPC title

• G11B5/3163

  Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• G11B5/70621

  containing Co metal or alloys · CPC title