Coil component and method of manufacturing the same

US11322291B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11322291-B2
Application numberUS-201816126554-A
CountryUS
Kind codeB2
Filing dateSep 10, 2018
Priority dateFeb 9, 2018
Publication dateMay 3, 2022
Grant dateMay 3, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A coil component comprising: a magnetic body; and a coil portion embedded in the magnetic body, wherein the coil portion includes: an internal insulating layer; first and second coil patterns respectively disposed on opposite surfaces of the internal insulating layer; a first insulating wall disposed between turns of the first coil pattern; a second insulating wall disposed between turns of the second coil pattern; a first external insulating layer covering the first insulating wall and the first coil pattern; a second external insulating layer covering the second insulating wall and the second coil pattern; and a connection portion disposed in the internal insulating layer to connect the first coil pattern and the second coil pattern to each other, and wherein the first insulating wall includes: a first protrusion protruding from an upper surface of the first coil pattern and extending in the first external insulating layer; and a second protrusion protruding from a lower surface of the first coil pattern, opposing the upper surface, and extending in the internal insulating layer, wherein a surface roughness of one surface of the first insulating wall facing the internal insulating layer is different from a surface roughness of another surface of the first insulating wall facing the first external insulating layer. 2. The coil component of claim 1 , wherein the connection portion includes a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer. 3. The coil component of claim 1 , wherein each of the first and second coil patterns is an electroplating layer. 4. The coil component of claim 1 , wherein the internal insulating layer includes a photosensitive resin. 5. The coil component of claim 2 , wherein the connection portion further includes a first intermetallic compound layer disposed between the first conductive layer and the second conductive layer. 6. The coil component of claim 5 , wherein the second conductive layer is disposed between the first conductive layer and one of the first and second coil patterns, and the connection portion further includes a second intermetallic compound layer between the one of the first and second coil patterns and the second conductive layer. 7. The coil component of claim 1 , wherein the magnetic body includes a core penetrating through the coil portion. 8. The coil component of claim 2 , wherein the first conductive layer includes copper (Cu). 9. The coil component of claim 8 , wherein the second conductive layer includes tin (Sn). 10. The coil component of claim 2 , wherein the second conductive layer includes tin (Sn). 11. The coil component of claim 2 , wherein a width of the second conductive layer is greater than a width of the first conductive layer. 12. The coil component of claim 1 , wherein a surface of the first coil pattern facing the first external insulating layer is flat, and the flat surface of the first coil pattern, facing the first external insulating layer, extends from side surfaces of the first coil pattern. 13. The coil component of claim 1 , wherein no seed layer is disposed between the first coil pattern and the internal insulating layer. 14. The coil component of claim 1 , wherein no seed layer is disposed between the second coil pattern and the internal insulating layer. 15. The coil component of claim 1 , wherein no seed layer is disposed between the first coil pattern and the internal insulating layer, and between the second coil pattern and the internal insulating layer. 16. The coil component of claim 1 , wherein the second insulating wall includes a third protrusion protruding from a lower surface of the second coil pattern and extending in the second external insulating layer. 17. The coil component of claim 1 , wherein the second insulating wall includes a fourth protrusion protruding from an upper surface of the second coil pattern and extending in the internal insulating layer. 18. The coil component of claim 1 , wherein the second insulating wall includes: a third protrusion protruding from a lower surface of the second coil pattern and extending in the second external insulating layer; and a fourth protrusion protruding from an upper surface of the second coil pattern and extending in the internal insulating layer. 19. The coil component of claim 1 , wherein the first and second coil patterns are respectively disposed directly on the opposite surfaces of the internal insulating layer.

Assignees

Inventors

Classifications

  • using electric currents {, e.g. electroplating} · CPC title

  • Insulating of windings ({impregnating or encapsulating of transformers H01F41/005} ; of conductors in general H01B13/06) · CPC title

  • Printed windings · CPC title

  • with stacked layers · CPC title

  • with magnetic core · CPC title

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Frequently asked questions

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What does patent US11322291B2 cover?
A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion in…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 03 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).