Microbattery with through-silicon via electrodes

Patent metadata

Field	Value
Publication number	US-11316164-B2
Application number	US-201916524843-A
Country	US
Kind code	B2
Filing date	Jul 29, 2019
Priority date	May 31, 2016
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

First claim

What is claimed is:

1. A battery, comprising:
an anode structure, comprising:
an anode substrate;
an anode formed on the anode substrate;
an anode conductive liner that is in contact with the anode; and
anode through vias that pierce the anode substrate and that are in contact with the anode conductive liner;

a cathode structure, comprising:
a cathode substrate;
a cathode formed on the cathode substrate;
a cathode conductive liner that is in contact with the cathode; and
cathode through vias that pierce the cathode substrate and that are in contact with the cathode conductive liner; and

a conductive overcoat formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure,
wherein at least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

2. The battery of claim 1 , wherein only one of the group consisting of the anode through vias and the cathode through vias is in electrical contact with the conductive overcoat.

3. The battery of claim 1 , wherein the through vias comprise an insulating fill that seals the respective vias.

4. The battery of claim 3 , wherein the insulating fill comprises a polymer adhesive.

5. The battery of claim 1 , wherein the conductive overcoat leaves an external surface of the anode structure exposed.

6. The battery of claim 1 , wherein the conductive overcoat leaves an external surface of the cathode structure exposed.

7. The battery of claim 1 , further comprising vertical walls that separate the anode structure from the cathode structure.

8. The battery of claim 7 , wherein a joint between the anode structure and the vertical walls is a metallic joint and wherein a joint between the vertical walls and the cathode structure is a polymer adhesive.

9. The battery of claim 1 , wherein the cathode substrate has a greater diameter than the anode substrate, such that a rim of exposed cathode substrate is exposed at a point of contact between the anode and the cathode.

Assignees

• IBM

Inventors

• Andry Paul S
• Webb Bucknell C

Classifications

• H01M2220/30

  Batteries in portable systems, e.g. mobile phone, laptop · CPC title

• H01M6/40

  Printed batteries {, e.g. thin film batteries} · CPC title

• H01M4/624 Primary

  Electric conductive fillers · CPC title

• H01M2004/021

  Physical characteristics, e.g. porosity, surface area · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title