Ti—Ni-based alloy; wire, electrically conductive actuator, and temperature sensor, each using this alloy; and method of producing a Ti—Ni-based alloy

US11313732B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11313732-B2
Application numberUS-201916731669-A
CountryUS
Kind codeB2
Filing dateDec 31, 2019
Priority dateOct 10, 2017
Publication dateApr 26, 2022
Grant dateApr 26, 2022

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Abstract

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A Ti—Ni-based alloy, which has a torsion angle for Interface I that is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°; a wire, an electrically conductive actuator, and a temperature sensor, each of which uses that alloy; and a method of producing the Ti—Ni-based alloy.

First claim

Opening claim text (preview).

The invention claimed is: 1. A Ti—Ni-based alloy, which has a torsion angle for Interface I, which is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°, wherein the Ti—Ni-based alloy comprises 25.0 to 35.0 atom % of Ni, 0.0 to 10.0 atom % of Hf, and 15.0 to 25.0 atom % of Cu, with a balance being Ti and unavoidable impurities, in which a content of each unavoidable impurity is 0.1 atom % or less, and wherein the Ti—Ni-based alloy has a recrystallized structure, and is a Ti—Ni-based shape memory alloy or a Ti—Ni-based superelastic alloy, wherein a crystal structure of the martensitic phase is a single phase of B19′ or B19, or is a mixed phase in which the B19′ phase or the B19 phase co-exists simultaneously with another phase, and wherein the torsion angle is determined by X-ray diffraction measurement under conditions of CuKα as an X-ray source, a tube voltage of 45 kV, a tube current of 40 mA, and a measurement range of 15° to 120°. 2. The Ti—Ni-based alloy according to claim 1 , in which a transformation temperature after 10 cycles in a thermal cycle test is lowered by 1.0° C. or less, and the thermal cycle test is performed by Differential Scanning Calorimeter under conditions of a temperature rising or lowering speed of 10° C./min, α-Al 2 O 3 as a reference sample, and a temperature range of −130° C. to 250° C. 3. A wire, which is composed of the Ti—Ni-based alloy according to claim 1 . 4. An electrically conductive actuator, in which the wire according to claim 3 is applied. 5. A temperature sensor, in which the wire according to claim 3 is applied. 6. A method of producing the Ti—Ni-based alloy according to claim 1 , with the method comprising: a step of melting the Ti—Ni-based alloy having an alloy composition as defined in claim 1 , and casting the thus-molten alloy at a cooling speed of 10° C./second or higher; and a step of homogenization treatment, wherein: the melting is vacuum arc melting, vacuum dielectric melting, plasma melting, or electron beam melting, the casting is done using a mold with a thermal conductivity of 12 W/(m·K) or higher, and the homogenization treatment is carried out at a temperature of 800° C. or higher for one hour or longer. 7. A method of producing the Ti—Ni-based alloy according to claim 1 , with the method comprising the following Steps (a) to (d): Step (a): a step of melting the Ti—Ni-based alloy having an alloy composition as defined in claim 1 , and casting the thus-molten alloy at a cooling speed of 10° C./second or higher; Step (b): a step of hot working the resultant alloy at a temperature higher than a recrystallization temperature; Step (c): a step of performing intermediate annealing, and cold working at a cumulative working ratio of 15% or higher; and Step (d): a step of forming a desired shape, by imparting a shape memory effect, and imparting a shape memory effect at a temperature at which a desired shape memory effect is obtained when the resultant alloy is re-heated to a temperature higher than or equal to a reverse martensitic transformation finish temperature (A f temperature), wherein: the melting of Step (a) is vacuum arc melting, vacuum dielectric melting, plasma melting, or electron beam melting, and the casting of Step (a) is done using a mold with a thermal conductivity of 12 W/(m·K) or higher. 8. A Ti—Ni-based alloy, which has a torsion angle for Interface I, which is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°, wherein the Ti—Ni-based alloy comprises 25.0 to 35.0 atom % of Ni, 3.0 to 10.0 atom % of Hf, and 15.0 to 25.0 atom % of Cu, with a balance being Ti and unavoidable impurities, in which a content of each unavoidable impurity is 0.1 atom % or less, and wherein the Ti—Ni-based alloy has a recrystallized structure, and is a Ti—Ni-based shape memory alloy or a Ti—Ni-based superelastic alloy, wherein a crystal structure of the martensitic phase is a mixed phase in which a B19′ phase co-exists simultaneously with another phase, and wherein the torsion angle is determined by X-ray diffraction measurement under conditions of CuKα as an X-ray source, a tube voltage of 45 kV, a tube current of 40 mA, and a measurement range of 15° to 120°. 9. The Ti—Ni-based alloy according to claim 1 , in which the crystal structure of the martensitic phase is a mixed phase having the B19′ phase and a Cm structure, or a mixed phase having the B19′ phase and the B19 phase.

Assignees

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Classifications

  • G01K5/48Primary

    the material being a solid · CPC title

  • High-melting or refractory metals or alloys based thereon · CPC title

  • into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars · CPC title

  • C22C14/00Primary

    Alloys based on titanium · CPC title

  • Influencing the temperature of the metal, e.g. by heating or cooling the mould · CPC title

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What does patent US11313732B2 cover?
A Ti—Ni-based alloy, which has a torsion angle for Interface I that is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°; a wire, an electrically conductive actuator, and a temperature sensor, each of which uses that alloy; and a method of producing the Ti—Ni-based alloy.
Who is the assignee on this patent?
Furukawa Techno Mat Co Ltd, Tokyo Inst Tech, Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01K5/48. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 26 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).