In-Situ Temperature Sensing Substrate, System, and Method
US-2019368944-A1 · Dec 5, 2019 · US
US11313732B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11313732-B2 |
| Application number | US-201916731669-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 31, 2019 |
| Priority date | Oct 10, 2017 |
| Publication date | Apr 26, 2022 |
| Grant date | Apr 26, 2022 |
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A Ti—Ni-based alloy, which has a torsion angle for Interface I that is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°; a wire, an electrically conductive actuator, and a temperature sensor, each of which uses that alloy; and a method of producing the Ti—Ni-based alloy.
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The invention claimed is: 1. A Ti—Ni-based alloy, which has a torsion angle for Interface I, which is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°, wherein the Ti—Ni-based alloy comprises 25.0 to 35.0 atom % of Ni, 0.0 to 10.0 atom % of Hf, and 15.0 to 25.0 atom % of Cu, with a balance being Ti and unavoidable impurities, in which a content of each unavoidable impurity is 0.1 atom % or less, and wherein the Ti—Ni-based alloy has a recrystallized structure, and is a Ti—Ni-based shape memory alloy or a Ti—Ni-based superelastic alloy, wherein a crystal structure of the martensitic phase is a single phase of B19′ or B19, or is a mixed phase in which the B19′ phase or the B19 phase co-exists simultaneously with another phase, and wherein the torsion angle is determined by X-ray diffraction measurement under conditions of CuKα as an X-ray source, a tube voltage of 45 kV, a tube current of 40 mA, and a measurement range of 15° to 120°. 2. The Ti—Ni-based alloy according to claim 1 , in which a transformation temperature after 10 cycles in a thermal cycle test is lowered by 1.0° C. or less, and the thermal cycle test is performed by Differential Scanning Calorimeter under conditions of a temperature rising or lowering speed of 10° C./min, α-Al 2 O 3 as a reference sample, and a temperature range of −130° C. to 250° C. 3. A wire, which is composed of the Ti—Ni-based alloy according to claim 1 . 4. An electrically conductive actuator, in which the wire according to claim 3 is applied. 5. A temperature sensor, in which the wire according to claim 3 is applied. 6. A method of producing the Ti—Ni-based alloy according to claim 1 , with the method comprising: a step of melting the Ti—Ni-based alloy having an alloy composition as defined in claim 1 , and casting the thus-molten alloy at a cooling speed of 10° C./second or higher; and a step of homogenization treatment, wherein: the melting is vacuum arc melting, vacuum dielectric melting, plasma melting, or electron beam melting, the casting is done using a mold with a thermal conductivity of 12 W/(m·K) or higher, and the homogenization treatment is carried out at a temperature of 800° C. or higher for one hour or longer. 7. A method of producing the Ti—Ni-based alloy according to claim 1 , with the method comprising the following Steps (a) to (d): Step (a): a step of melting the Ti—Ni-based alloy having an alloy composition as defined in claim 1 , and casting the thus-molten alloy at a cooling speed of 10° C./second or higher; Step (b): a step of hot working the resultant alloy at a temperature higher than a recrystallization temperature; Step (c): a step of performing intermediate annealing, and cold working at a cumulative working ratio of 15% or higher; and Step (d): a step of forming a desired shape, by imparting a shape memory effect, and imparting a shape memory effect at a temperature at which a desired shape memory effect is obtained when the resultant alloy is re-heated to a temperature higher than or equal to a reverse martensitic transformation finish temperature (A f temperature), wherein: the melting of Step (a) is vacuum arc melting, vacuum dielectric melting, plasma melting, or electron beam melting, and the casting of Step (a) is done using a mold with a thermal conductivity of 12 W/(m·K) or higher. 8. A Ti—Ni-based alloy, which has a torsion angle for Interface I, which is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°, wherein the Ti—Ni-based alloy comprises 25.0 to 35.0 atom % of Ni, 3.0 to 10.0 atom % of Hf, and 15.0 to 25.0 atom % of Cu, with a balance being Ti and unavoidable impurities, in which a content of each unavoidable impurity is 0.1 atom % or less, and wherein the Ti—Ni-based alloy has a recrystallized structure, and is a Ti—Ni-based shape memory alloy or a Ti—Ni-based superelastic alloy, wherein a crystal structure of the martensitic phase is a mixed phase in which a B19′ phase co-exists simultaneously with another phase, and wherein the torsion angle is determined by X-ray diffraction measurement under conditions of CuKα as an X-ray source, a tube voltage of 45 kV, a tube current of 40 mA, and a measurement range of 15° to 120°. 9. The Ti—Ni-based alloy according to claim 1 , in which the crystal structure of the martensitic phase is a mixed phase having the B19′ phase and a Cm structure, or a mixed phase having the B19′ phase and the B19 phase.
the material being a solid · CPC title
High-melting or refractory metals or alloys based thereon · CPC title
into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars · CPC title
Alloys based on titanium · CPC title
Influencing the temperature of the metal, e.g. by heating or cooling the mould · CPC title
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