Electronic module

Patent metadata

Field	Value
Publication number	US-11309273-B2
Application number	US-201716060279-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 19, 2017
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.

First claim

The invention claimed is:

1. An electronic module comprising:
a first substrate;
a first conductor layer provided on one side of the first substrate;
a first electronic element provided on one side of the first conductor layer;
a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
a second electronic element provided on one side of the first connection body;
a second substrate provided on one side of the second electronic element and being a flat plate larger than the first electronic element and the second electronic element in plane;
a second conductor layer provided on the other side of the second substrate; and
an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second conductor layer or the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first conductor layer or the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.

2. An electronic module comprising:
a first substrate that is a metal substrate;
a first electronic element provided on one side of the first substrate;
a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
a second electronic element provided on one side of the first connection body;
a second substrate provided on one side of the second electronic element, and being a metal substrate and being a metal substrate being a flat plate larger than the first electronic element and the second electronic element in plane; and
an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.

3. The electronic module according to claim 1 , wherein
the second-substrate-side abutment part has a first convex part protruding to one side, and
the second-substrate-side abutment part abuts on the second conductor layer or the second substrate via conductive adhesive.

4. The electronic module according to claim 1 , wherein
the abutment body has a plurality of leg parts extending to the other side in addition to the first-substrate-side abutment part; and
the plurality of leg parts are configured to abut on the first conductor layer or the first substrate.

5. The electronic module according to claim 4 , wherein
an area where the plurality of leg parts abut on the first conductor layer or the first substrate is smaller than an area of the first-substrate-side abutment part abuts on the first conductor layer or the first substrate.

Assignees

• Shindengen Electric Mfg

Inventors

• Ikeda Kosuke
• Matsuzaki Osamu

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/886

  Die-attach connectors and strap connectors · CPC title