Splicing nano-imprint template with repair adhesive layer, repair method of splicing seam thereof, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11307499-B2
Application number	US-202016830820-A
Country	US
Kind code	B2
Filing date	Mar 26, 2020
Priority date	Nov 26, 2019
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

Embodiments of the present disclosure provide a splicing nano-imprint template, a repair method of a splicing seam thereof, and a manufacturing method thereof. The repair method of the splicing seam of the splicing nano-imprint template includes: providing a splicing nano-imprint plate, in which the splicing nano-imprint plate includes a base substrate and splicing modules that are positioned on the base substrate, a splicing seam is provided between adjacent spicing modules, and each of the splicing modules includes a unit pattern; forming a repair adhesive layer at least at the splicing seam; and performing a patterning process on the repair adhesive layer to form a repair module, in which the repair module includes the unit pattern.

First claim

What is claimed is:

1. A repair method of a splicing seam of a splicing nano-imprint template, comprising:
providing a splicing nano-imprint plate, wherein the splicing nano-imprint plate comprises a base substrate and a plurality of splicing modules that are positioned on the base substrate, a splicing seam is provided between adjacent spicing modules, and each of the splicing modules comprises a unit pattern;
forming a repair adhesive layer at least at the splicing seam; and
performing a patterning process on the repair adhesive layer to form a repair module, wherein the repair module comprises the unit pattern, wherein
the repair adhesive layer is an imprint adhesive layer; and
the forming the repair adhesive layer at least at the splicing seam, comprises:
forming an anti-sticking layer on the splicing modules, and
forming the imprint adhesive layer at the splicing seam as the repair adhesive layer.

2. The repair method according to claim 1 , wherein the performing the patterning process on the repair adhesive layer to form the repair module, comprises:
imprinting the imprint adhesive layer by using an imprint template, wherein the imprint template comprises the unit pattern;
performing a curing process on the imprint adhesive layer by taking an edge of the imprint template as a boundary; and
separating the imprint template from the imprint adhesive layer to form the repair module.

3. The repair method according to claim 1 , wherein the forming the anti-sticking layer on the splicing modules, comprises:
forming the anti-sticking layer on the splicing modules by using a printing method, wherein a distance between an edge of the anti-sticking layer close to the splicing seam and an edge of one of the splicing modules close to the splicing seam is less than 1 micrometer.

4. The repair method according to claim 3 , wherein the edge of the anti-sticking layer close to the splicing seam is aligned with the edge of the one of the splicing modules close to the splicing seam.

5. The repair method according to claim 1 , wherein a material of the anti-sticking layer comprises fluorine-containing silane-based compounds.

6. A manufacturing method of a splicing nano-imprint template, comprising: the repair method according to claim 1 , wherein the manufacturing method further comprises:
providing the base substrate, wherein the base substrate comprises a plurality of splicing regions and the splicing seam positioned between adjacent splicing regions;
forming the plurality of splicing modules by using a nano-imprint method; and
respectively fixing the plurality of splicing modules to the splicing regions of the base substrate to form the splicing nano-imprint plate.

7. A repair method of a splicing seam of a splicing nano-imprint template, comprising:
providing a splicing nano-imprint plate, wherein the splicing nano-imprint plate comprises a base substrate and a plurality of splicing modules that are positioned on the base substrate, a splicing seam is provided between adjacent spicing modules, and each of the splicing modules comprises a unit pattern;
forming a repair adhesive layer at least at the splicing seam; and
performing a patterning process on the repair adhesive layer to form a repair module, wherein the repair module comprises the unit pattern,
wherein the forming the repair adhesive layer at least at the splicing seam comprises:
forming a photoresist layer at the splicing seam as the repair adhesive layer
wherein the performing the patterning process on the repair adhesive layer to form the repair module comprises:
irradiating a portion of the photoresist layer by using a femtosecond laser so that the photoresist layer comprises a cured portion and an uncured portion; and
removing the uncured portion of the photoresist layer to form the repair module.

8. The repair method according to claim 7 , wherein a wavelength range of the femtosecond laser is 700 nm-900 nm.

9. The repair method according to claim 8 , wherein the wavelength of the femtosecond laser is 800 nm.

10. A splicing nano-imprint template, comprising:
a base substrate,
a nano-imprint structure, positioned on the base substrate, and comprising a plurality of splicing modules and a repair module that is positioned between adjacent splicing modules, wherein the repair module and each of the splicing modules comprise a unit pattern;
a splicing seam provided between adjacent spicing modules, and each of the splicing modules comprises a unit pattern; and
a repair adhesive layer provided at least at the splicing seam;
wherein the repair adhesive layer is an imprint adhesive layer, and
the repair adhesive layer comprises an anti-sticking layer on the splicing modules.

11. The splicing nano-imprint template according to claim 10 , wherein an edge of one of the splicing modules close to the repair module is in direct contact with an edge of the repair module close to the one of the splicing modules.

12. The splicing nano-imprint template according to claim 10 , wherein each of the splicing modules comprises a plurality of the unit patterns that are arranged according to a period, and the repair module comprises a plurality of the unit patterns that are arranged according to the period.

13. The splicing nano-imprint template according to claim 12 , wherein at an interface where the repair module and one of the splicing modules contact with each other, the period is continuous.

14. The splicing nano-imprint template according to claim 13 , wherein
each of the unit patterns comprises a groove and a protrusion that are alternately provided;
an edge of the one of the splicing modules close to the repair module is provided with the groove, and an edge of the repair module close to the one of the splicing modules is provided with the protrusion; or, the edge of the one of the splicing modules close to the repair module is provided with the protrusion, and the edge of the repair module close to the one of the splicing modules is provided with the groove.

15. The splicing nano-imprint template according to claim 12 , wherein at an interface where the repair module and one of the splicing modules contact with each other, the period is discontinuous.

16. The splicing nano-imprint template according to claim 15 , wherein
each of the unit patterns comprises a groove and a protrusion that are alternately provided;
an edge of the one of the splicing modules close to the repair module is provided with the groove, and an edge of the repair module close to the one of the splicing modules is provided with the groove; or, the edge of the one of the splicing modules close to the repair module is provided with the protrusion, and the edge of the repair module close to the one of the splicing modules is provided with the protrusion.

17. The splicing nano-imprint template according to claim 10 , further comprising:
a seed layer, provided on a side of the nano-imprint structure away from the base substrate.

18. The splicing nano-imprint template according to claim 17 , wherein a material of the seed layer comprises nickel and/or copper.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Lu Yanhui
• Li Duohui
• Zhou Xueyuan

Classifications

• H10P76/2042

  using lasers · CPC title

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• B29C73/02 Primary

  using liquid or paste-like material (B29C73/16 takes precedence) · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F7/2002 Primary

  with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title