Vehicle vision system camera with coaxial cable connector
US-10555423-B2 · Feb 4, 2020 · US
US11304306B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11304306-B2 |
| Application number | US-202016779818-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2020 |
| Priority date | Jun 24, 2013 |
| Publication date | Apr 12, 2022 |
| Grant date | Apr 12, 2022 |
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A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via the solder pads. The solder pads may include a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector.
Opening claim text (preview).
The invention claimed is: 1. A method for assembling a camera suitable for use for a vision system of a vehicle, the method comprising: providing a circuit board having first and second sides separated by a thickness dimension of the circuit board, wherein an imager is disposed at the first side of the circuit board, and wherein solder pads are disposed at the second side of the circuit board and in electrical connection with circuitry of the circuit board; aligning a coaxial connector at the solder pads at the second side of the circuit board, wherein the step of aligning the coaxial connector at the solder pads comprises tilting and shifting of the coaxial connector relative to the solder pads via a robot that adjusts the coaxial connector relative to a base coordinate system of the circuit board; and soldering the coaxial connector at the second side of the circuit board via the solder pads. 2. The method of claim 1 , comprising, before the step of soldering the coaxial connector at the second side of the circuit board, determining when the coaxial connector is aligned with the solder pads at the second side of the circuit board, wherein the step of soldering the coaxial connector at the second side of the circuit board is responsive to determination that the coaxial connector is aligned with the solder pads. 3. The method of claim 2 , wherein the step of determining when the coaxial connector is aligned with the solder pads comprises determining when the coaxial connector is aligned with the solder pads via a contactless measuring system. 4. The method of claim 1 , wherein the solder pads have a height dimension at the circuit board of at least 1 mm. 5. The method of claim 1 , wherein soldering the coaxial connector at the second side of the circuit board via the solder pads comprises at least one of (i) heating the solder pads via a laser, (ii) heating the solder pads via application of heated air, (iii) heating the coaxial connector itself, (iv) conductive heating of the solder pads and (v) inductive heating of the solder pads. 6. The method of claim 1 , wherein each solder pad has solder paste disposed thereat, and wherein soldering the coaxial connector at the second side of the circuit board comprises melting the solder paste at the solder pads. 7. The method of claim 6 , wherein the solder pads comprise a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector. 8. The method of claim 6 , wherein the solder pads comprise four outer solder pads disposed around one inner solder pad.
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