Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

Patent metadata

Field	Value
Publication number	US-11299653-B2
Application number	US-201916598546-A
Country	US
Kind code	B2
Filing date	Oct 10, 2019
Priority date	Apr 11, 2017
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

First claim

What is claimed is:

1. A composition for forming an adhesive film for imprinting, comprising:
at least one of the following compound 1 and the following compound group 2,
the compound 1: a compound that has a polymerizable group and a polarity conversion group, and is a resin, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more, and
the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group; and

a solvent,
wherein a content of the solvent in the composition is 80 mass % or more,
the compound having a polymerizable group and a polarity conversion group, and the compound not having a polymerizable group and having a polarity conversion group each independently are a compound decomposable into two or more compounds in a case where the polarity conversion group is treated, and
among the two or more compounds, at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more.

2. The composition according to claim 1 , wherein the treatment is at least one of heating at 100° C. to 250° C., light irradiation, and chemical treatment.

3. The composition according to claim 1 , wherein the compound having a molecular weight of 30 to 400 among the generated compounds is selected from alkene, ether, aldehyde, alcohol, carbon dioxide, sulfonic acid, and carboxylic acid.

4. The composition according to claim 1 , comprising at least the compound 1.

5. The composition according to claim 4 , comprising the compound that does not have a polymerizable group and has a polarity conversion group.

6. The composition according to claim 1 , wherein the compound 1 is a (meth)acrylic resin.

7. The composition according to claim 1 ,
wherein at least one of repeating units having a polarity conversion group constituting the resin that is the compound 1 is a repeating unit derived from a monomer having the polarity conversion group, and
a C log P value of the monomer corresponding to a repeating unit obtained after subjecting the repeating unit having the polarity conversion group to the treatment is −10 to 0, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.

8. The composition according to claim 1 , wherein the compound 1 further has an alkyleneoxy chain.

9. The composition according to claim 1 , wherein a critical surface tension of a film formed of the component excluding the solvent from the composition is 35 mN/m or less, and a critical surface tension after the treatment of a film formed of the component excluding the solvent from the composition is 42 mN/m or more.

10. An adhesive film formed from the composition according to claim 1 .

11. The adhesive film according to claim 10 , wherein a critical surface tension is 42 mN/m or more.

12. A laminate comprising:
a substrate; and
an adhesive film positioned on a surface of the substrate,
wherein the adhesive film is the adhesive film according to claim 10 .

13. The laminate according to claim 12 , further comprising a layer formed from a curable composition for imprinting on a surface of the adhesive film.

14. The laminate according to claim 12 , further comprising a cured product pattern formed of a curable composition for imprinting on a surface of the adhesive film.

15. A method for producing a cured product pattern, the method comprising:
an adhesive film formation step of forming an adhesive film by applying the composition according to claim 1 onto a substrate;
an application step of applying a curable composition for imprinting onto a surface of the adhesive film;
a mold contact step of bringing the curable composition for imprinting into contact with a mold having a pattern for transferring a pattern shape;
a light irradiation step of irradiating the curable composition for imprinting with light to form a cured product; and
a release step of separating the cured product and the mold from each other.

16. A method for manufacturing a circuit substrate, the method comprising:
a step of obtaining a cured product pattern through the production method according to claim 15 .

Assignees

• Fujifilm Corp

Inventors

• Shimoju Naoya
• Shibuya Akinori
• Goto Yuichiro

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• C08F230/02

  containing phosphorus · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J7/30 Primary

  characterised by the adhesive composition · CPC title

• B32B37/12

  characterised by using adhesives · CPC title