Deep trench capacitor distribution

Patent metadata

Field	Value
Publication number	US-11296093-B2
Application number	US-202016804062-A
Country	US
Kind code	B2
Filing date	Feb 28, 2020
Priority date	Feb 28, 2020
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design is provided. The method includes forming a placement block that includes blockages defining openings in interstitial regions among the blockages, superimposing the placement block over the IC design and providing distributed DT capacitance to the IC design. The providing of the distributed DT capacitance includes adding DT capacitance cells through the openings to portions of the IC design where there are no reserved blocks.

First claim

What is claimed is:

1. A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design, the method comprising:
forming a placement block comprising blockages defining openings in interstitial regions among the blockages;
superimposing the placement block over the IC design; and
providing substantially evenly distributed DT capacitance to an entirety of the IC design except for at locations of reserved blocks by adding DT capacitance cells through the openings to those portions of the IC design where there are no reserved blocks.

2. The method according to claim 1 , wherein the reserved blocks comprise blocks of memory cells.

3. The method according to claim 1 , wherein sizes and distributions of the blockages are based on sizes of gates of the IC design.

4. The method according to claim 1 , wherein the blockages are arranged in a matrix pattern.

5. The method according to claim 1 , further comprising:
removing fillers from the IC design prior to the providing of the distributed DT capacitance; and
adding the fillers back into the IC design following the providing of the distributed DT capacitance.

6. The method according to claim 1 , further comprising:
removing the placement block; and
adding additional IC design elements to the IC design provided with the distributed DT capacitance.

7. The method according to claim 6 , wherein the additional IC design elements comprise buffers, local clock buffers, latches and engineering change order (ECO) buffers.

8. The method according to claim 1 , further comprising inserting engineering change order (ECO) cells to the IC design provided with the distributed DT capacitance.

9. A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design comprising reserved blocks, the method comprising:
forming a placement block comprising blockages defining openings in interstitial regions among the blockages without regard to respective positions of the reserved blocks;
superimposing the placement block over the IC design; and
providing substantially evenly distributed DT capacitance to an entirety of the IC design except for at locations of reserved blocks by substantially evenly adding DT capacitance cells through the openings to those portions of the IC design where there are no reserved blocks.

10. The method according to claim 9 , wherein the reserved blocks comprise blocks of memory cells.

11. The method according to claim 9 , wherein sizes and distributions of the blockages are based on sizes of gates of the IC design.

12. The method according to claim 9 , wherein the blockages are arranged in a matrix pattern.

13. The method according to claim 9 , further comprising:
removing fillers from the IC design prior to the providing of the distributed DT capacitance; and
adding the fillers back into the IC design following the providing of the distributed DT capacitance.

14. The method according to claim 9 , further comprising:
removing the placement block; and
adding additional IC design elements to the IC design provided with the distributed DT capacitance.

15. The method according to claim 14 , wherein the additional IC design elements comprise buffers, local clock buffers, latches and engineering change order (ECO) buffers.

16. The method according to claim 9 , further comprising inserting engineering change order (ECO) cells to the IC design provided with the distributed DT capacitance.

Assignees

• IBM

Inventors

• Regev Asaf
• Berry Christopher
• Geva Ofer
• Atias Amit Amos
• Schell Timothy A

Classifications

• H10D1/68

  Capacitors having no potential barriers · CPC title

• H10D1/047

  of conductor-insulator-semiconductor capacitors, e.g. trench capacitors · CPC title

• G06F30/392 Primary

  Floor-planning or layout, e.g. partitioning or placement · CPC title

• H01L27/10897

  Electricity · mapped topic

• H01L29/66181

  Electricity · mapped topic