Method for vapor depositing a substrate

US11293090B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11293090-B2
Application numberUS-201816338133-A
CountryUS
Kind codeB2
Filing dateSep 6, 2018
Priority dateDec 14, 2017
Publication dateApr 5, 2022
Grant dateApr 5, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to the field of vapor deposition technologies, and discloses a vapor deposition method. The vapor deposition method includes: applying an exciting acoustic wave to the target, such that particles in a predetermined location of the target break away from the target and adhere to a predetermined region of the substrate when an energy of the particles is higher than an energy required for the particles to break away from the target. By using the vapor deposition method, losses of vapor deposition materials may be avoided, utilization of the vapor deposition materials may be increased, and thus costs may be reduced.

First claim

Opening claim text (preview).

What is claimed is: 1. A vapor deposition method comprising: providing a target; providing a substrate, the substrate configured to receive particles from the target; and applying an exciting acoustic wave to the target, such that the particles in a predetermined location of the target break away from the target and adhere to a predetermined region of the substrate when an energy of the particles is higher than an energy required for the particles to break away from the target, wherein the exciting acoustic wave is a rectangular standing wave, and the rectangular standing wave is synthesized using a plurality of sine waves or a plurality of cosine waves, wherein synthesizing the rectangular standing wave comprises: partitioning the target into a plurality of periodic units according to a vapor deposition requirement of the substrate, a function of the rectangular standing wave being expressed as: f ⁡ ( x ) = a 0 2 + ∑ 1 ∞ ⁢ a n ⁢ cos ⁡ ( nx L ) , wherein a 0 represents an amplitude of the rectangular standing wave, a n represents an amplitude of the sine wave or an amplitude of the cosine wave, n represents a number of the sine waves or a number of the cosine waves, and L represents a width of the periodic unit. 2. The vapor deposition method according to claim 1 , wherein a wavelength value of the sine wave and a wavelength value of the cosine wave are within a wavelength value range of an ultrasonic wave. 3. The vapor deposition method according to claim 1 , wherein before applying an exciting acoustic wave to the target, the vapor deposition method further comprises: heating the target, such that an energy of the target is lower than the energy required for the particles to break away from the target. 4. The vapor deposition method according to claim 3 , wherein a temperature for heating the target ranges from 400° C. to 500° C.

Assignees

Inventors

Classifications

  • using heated targets · CPC title

  • by sputtering · CPC title

  • C23C14/28Primary

    by wave energy or particle radiation (C23C14/32 - C23C14/48 take precedence) · CPC title

  • Microwaves, e.g. electron cyclotron resonance enhanced sputtering · CPC title

  • using pulsed power to the target · CPC title

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What does patent US11293090B2 cover?
The present disclosure relates to the field of vapor deposition technologies, and discloses a vapor deposition method. The vapor deposition method includes: applying an exciting acoustic wave to the target, such that particles in a predetermined location of the target break away from the target and adhere to a predetermined region of the substrate when an energy of the particles is higher than …
Who is the assignee on this patent?
Beijing Boe Display Tech Co, Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C14/28. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).