Ceramic substrate and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-11291113-B2
Application number	US-201716306984-A
Country	US
Kind code	B2
Filing date	Jun 14, 2017
Priority date	Jun 21, 2016
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A ceramic substrate is provided in which an inclined protrusion is formed on boundary surface of a metal layer bonded to a ceramic base so as to increase bonding strength; and a manufacturing method therefor. The inclined protrusion may include: a tapered protrusion and a multi-stepped protrusion formed on the boundary surface of the metal layer according to an interval between the metal layer bonded to the ceramic base and a neighboring metal layer, wherein a multi-stepped protrusion having an inclination angle within a predetermined angle range with respect to the ceramic base may be formed on the boundary surface of the metal layer where stress is concentrated, such as the short edge, apex, corner, and the like, and a tapered protrusion may be formed on a remaining portion of the boundary surface of the metal layer.

First claim

The invention claimed is:

1. A ceramic substrate, comprising:
a ceramic base; and
a metal layer bonded to at least one surface of the ceramic base,
wherein the metal layer has an inclined protrusion formed on a boundary surface thereof,
wherein the inclined protrusion has multiple consecutive concave portions, and
wherein the inclined protrusion has a pointed protrusion formed at a portion where each of the concave portion and a neighboring concave portion are in contact with each other.

2. The ceramic substrate of claim 1 , wherein the inclined protrusion inclinedly extends from an upper edge of the metal layer to protrude toward an outside end of the ceramic base through a virtual line which is perpendicular to the ceramic substrate.

3. The ceramic substrate of claim 1 , wherein the inclined protrusion increases in protruding length toward the ceramic base.

4. The ceramic substrate of claim 1 , wherein the inclined protrusion is formed in a shape concaved toward the ceramic base.

5. The ceramic substrate of claim 1 , wherein the inclined protrusion is formed to have a protruding length toward the ceramic base, the protruding length being shorter than a thickness of the metal layer.

6. The ceramic substrate of claim 1 , wherein the inclined protrusion includes a tapered protrusion and a multi-stepped protrusion, and
an interval between the boundary surface of the metal layer on which the tapered protrusion is formed and a neighboring metal layer is smaller than an interval between the boundary surface of the metal layer on which the multi-stepped protrusion is formed and the neighboring metal layer.

7. The ceramic substrate of claim 1 , wherein when an interval between the metal layer and a neighboring metal layer is greater than a maximum set interval, a multi-stepped protrusion is formed on a portion of the boundary surface of the metal layer, the portion of the boundary surface facing the neighboring metal layer.

8. The ceramic substrate of claim 1 , wherein when an interval between the metal layer and a neighboring metal layer is less than a minimum set interval, a tapered protrusion is formed on a portion of the boundary surface of the metal layer, the portion of the boundary surface facing the neighboring metal layer.

9. The ceramic substrate of claim 1 , wherein when an interval between the metal layer and a neighboring metal layer ranges from equal to or greater than a minimum set interval to equal to or less than a maximum set interval, a tapered protrusion or multi-stepped protrusion is formed on a portion of the boundary surface of the metal layer, the portion of the boundary surface facing the neighboring metal layer.

10. The ceramic substrate of claim 9 , wherein when the tapered protrusion is formed on the neighboring metal layer, the multi-stepped protrusion is formed on the portion of the boundary surface of the metal layer, the portion of the boundary surface facing the neighboring metal layer, and
when the multi-stepped protrusion is formed on the neighboring metal layer, the tapered protrusion is formed on the portion of the boundary surface of the metal layer, the portion of the boundary surface facing the neighboring metal layer.

11. The ceramic substrate of claim 1 , wherein the inclined protrusion is formed on a portion of the boundary surface of the metal layer where stress is concentrated.

12. The ceramic substrate of claim 11 , wherein the multi-stepped protrusion is formed on the portion of the boundary surface of the metal layer at a position corresponding to at least one of a short edge, a corner, and an apex of the metal layer.

13. The ceramic substrate of claim 11 , wherein the multi-stepped protrusion has an inclination angle ranging from equal to or greater than 27° to equal to or less than 33°, and
the inclination angle is an angle between the surface of the ceramic base and a line connecting a point where the multi-stepped protrusion is in contact with the ceramic base and an apex of a protrusion formed between concave portions.

14. The ceramic substrate of claim 11 , wherein the inclined protrusion further includes a tapered protrusion formed on a remaining portion of the boundary surface of the metal layer.

15. The ceramic substrate of claim 14 , wherein the tapered protrusion has an inclination angle ranging from equal to or greater than 27° to equal to or less than 33°, and
the inclination angle is an angle between the surface of the ceramic base and a line connecting two points where the tapered protrusion is in contact with the metal layer and the ceramic base.

16. The ceramic substrate of claim 1 , wherein the inclined protrusion has a curved inclination.

Assignees

• Amosense Co Ltd

Inventors

• Lee Ji-Hyung
• Park Ik-Seong
• Cho Hyeon-Choon

Classifications

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H05K3/061

  Etching masks · CPC title

• H05K2203/0789

  Aqueous acid solution, e.g. for cleaning or etching · CPC title

• H05K3/388 Primary

  by the use of a metallic or inorganic thin film adhesion layer · CPC title

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title