Micro LED transfer device and micro led transferring method using the same

Patent metadata

Field	Value
Publication number	US-11289622-B2
Application number	US-202016832884-A
Country	US
Kind code	B2
Filing date	Mar 27, 2020
Priority date	Mar 27, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

First claim

What is claimed is:

1. A micro light emitting diode (LED) transfer device comprising:
a transfer part configured to transfer a relay substrate having at least one micro LED arranged at a lower part of the relay substrate;
an adhesive layer arranged between the relay substrate and the at least one micro LED;
a mask arranged at an upper part of the relay substrate, and having a plurality of openings, wherein a position of the plurality of openings corresponds to a position of the at least one micro LED;
a first laser configured to irradiate a first laser light having a first wavelength to the mask;
a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and
a processor configured to:
control the transfer part to cause the at least one micro LED to contact an upper part of a coupling layer of a target substrate, and
based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED,
wherein based on an area of the adhesive layer being irradiated with the first laser light, the adhesive layer is configured to separate a micro LED arranged on the area from among the at least one micro LED from the relay substrate, and
wherein based on an area of the coupling layer being irradiated with the second laser light, the coupling layer is configured to connect the separated micro LED to the target substrate.

2. The micro LED transfer device of claim 1 , wherein the target substrate comprises a plurality of connection pads formed at a plurality of predetermined positions, and
wherein the processor is configured to control the transfer part such that a plurality of electrode pads formed on the at least one micro LED are positioned facing the plurality of connection pads.

3. The micro LED transfer device of claim 2 , wherein the coupling layer comprises a polymer, and
wherein a solder paste is formed on each of the plurality of connection pads.

4. The micro LED transfer device of claim 1 , wherein the processor is configured to control the transfer part to continuously press the at least one micro LED into the coupling layer based on the first laser light and the second laser light being irradiated toward the at least one micro LED.

5. The micro LED transfer device of claim 1 , wherein the at least one micro LED is arranged on the relay substrate based on a characteristic information of the at least one micro LED such that output characteristics of a plurality of areas on which the at least micro LED is to be placed are uniform.

6. The micro LED transfer device of claim 5 , wherein the at least one micro LED comprises:
a first micro LED configured to emit a red light;
a second micro LED configured to emit a green light; and
a third micro LED configured to emit a blue light,
wherein the first micro LED, the second micro LED, and the third micro LED are arranged consecutively on the relay substrate.

7. The micro LED transfer device of claim 1 , wherein the coupling layer comprises at least one from among an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).

8. The micro LED transfer device of claim 1 , wherein the first wavelength comprises a wavelength in an ultraviolet ray (UV) range, and the second wavelength comprises a wavelength in an infrared ray (IR) range.

9. The micro LED transfer device of claim 1 , wherein the coupling layer is configured to cover a side surface of the at least one micro LED based on the at least one micro LED being bonded to the target substrate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Yoonsuk
• Park Sangmoo
• Kwag Doyoung
• Kim Byungchul
• Kim Eunhye
• Oh Minsub
• Lee Dongyeob

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07331

  Connecting techniques · CPC title