Semiconductor component and method for producing same

Patent metadata

Field	Value
Publication number	US-11289425-B2
Application number	US-201816633301-A
Country	US
Kind code	B2
Filing date	Jul 3, 2018
Priority date	Jul 25, 2017
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

First claim

What is claimed is:

1. A semiconductor component comprising:
a first carrier part;
a second carrier part arranged opposite the first carrier part;
a semiconductor element arranged between the first carrier part and the second carrier part;
a contact surface comprising an electrically-conductive material arranged on at least one of: the semiconductor element, the first carrier part, or the second carrier part;
a contact sleeve comprising an electrically-conductive material arranged on one of the carrier parts positioned directly opposite the contact surface, and positioned in opposition to said contact surface; and
a contact pin comprising an electrically-conductive material with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting;
wherein at least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

2. The semiconductor component as claimed in claim 1 , wherein the contact sleeve is arranged in an opening in the carrier part.

3. The semiconductor component as claimed in claim 1 , wherein the end face of the contact pin includes an electrically-conductive contact connection agent.

4. The semiconductor component as claimed in claim 1 , wherein the contact pin comprises a spacer element including an electrically insulating material.

5. A method for producing a semiconductor component, the method comprising:
arranging a semiconductor element between a first carrier part and a second carrier part arranged opposite the first carrier part; and
wherein a contact surface comprising an electrically-conductive material is disposed on at least one of: the semiconductor element, the first carrier part, or the second carrier part;
wherein one of the carrier parts comprises a contact sleeve including an electrically-conductive material positioned directly opposite the contact surface, in opposition to said contact surface;
wherein a contact pin comprising an electrically-conductive material is arranged such that one end face of an axial end of the contact pin electrically contact connects the contact surface; and
connecting a connection region of the contact pin arranged in the contact sleeve, in a region averted from the axial end, with the contact sleeve by a press fit; and
wherein the first carrier part and/or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

6. The method as claimed in claim 5 , wherein the contact connection of the contact surface by the end face of the contact pin and/or the connection of the connection region with the contact sleeve is executed upon the assembly of the semiconductor element, the first carrier part and the second carrier part.

7. The method as claimed in claim 5 , wherein the contact pin, in an end region of the end face, incorporates a spacer element of an electrically insulating material, wherein the spacer element is cured upon the assembly of the semiconductor element, the first carrier part and the second carrier part.

8. The method as claimed in claim 5 , further comprising applying a connection agent to the end face of the contact pin prior to the assembly of the semiconductor element, the first carrier part, and the second carrier part.

9. The method as claimed in claim 5 , wherein the press-fit between the connection region and the contact sleeve is constituted upon the assembly of the semiconductor element, the first carrier part, and the second carrier part.

Assignees

• Siemens Ag

Inventors

• Blank Rene
• Franke Martin
• Frühauf Peter
• Knofe Rüdiger
• Müller Bernd
• Nerreter Stefan
• Strogies Jörg
• Wilke Klaus

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title