Component mounting line

Patent metadata

Field	Value
Publication number	US-11289349-B2
Application number	US-201916388005-A
Country	US
Kind code	B2
Filing date	Apr 18, 2019
Priority date	Apr 25, 2018
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A component mounting line includes a plurality of component mounting apparatuses, each of which mounts solder and a component other than the solder on a substrate. The component mounting line includes: a time limit management unit configured to manage an elapsed time period of a member; and a usability determiner that determines whether the member is usable based on the elapsed time period of the member. The elapsed time period is a time period that has elapsed after the member is exposed to the air, and the member comprises at least one of a substrate, solder, and a component other than the solder.

First claim

What is claimed is:

1. A component mounting line comprising:
a plurality of component mounting apparatuses, each of which mounts a solder and a component other than the solder on a substrate; and
a quality control system comprising at least one processor having one or more integrated circuits configured to:
estimate an elapsed time period of a member, the elapsed time period being a time period that has elapsed after the member is exposed to air, the member comprising at least one of the substrate, the solder, and the component; and
determine whether the member can be manufactured within a component exposure time t 1 and a solder exposure time s 1 defining a good product area in a correlation chart indicating a relationship between the elapsed time period of the member and a probability of void formation in the solder mounted on the substrate, wherein:
when the elapsed time period of the member is greater than or equal to the solder exposure time s 1 and when the elapsed time period of the member is greater than or equal to the component exposure time t 1 , the quality control system stops an operation of the component mounting apparatuses,
when the elapsed time period of the member is less than a solder exposure time s 0 and when the elapsed time period of the member is less than a component exposure time t 0 , the quality control system continues the operation of the component mounting apparatuses, wherein the solder exposure time s 0 is less than the solder exposure time s 1 , and the component exposure time t 0 is less than the component exposure time t 1 , and
when the elapsed time period of the member is greater than or equal to the solder exposure time s 0 and less than the solder exposure time s 1 and when the elapsed time period of the member is greater than or equal to the component exposure time t 0 and less than the component exposure time t 0 , the quality control system causes the plurality of component mounting apparatuses to display a warning message.

2. The component mounting line according to claim 1 , further comprising:
an inspection controller that obtains an inspection result which is a result of a radiographic inspection conducted to examine a state of the substrate on which the solder and the component are mounted, wherein
the elapsed time period is a time period that has elapsed until the solder and the component are mounted on the substrate, the probability of void formation being calculated based on the inspection result.

3. The component mounting line according to claim 2 , wherein
the at least one processor is further configured to obtain, based on the correlation chart, a first threshold value for the elapsed time period, below which the probability of void formation is less than or equal to a predetermined value, and determines that the member can be manufactured within the component exposure time t 1 and the solder exposure time s 1 when the elapsed time period is less than the first threshold value.

4. The component mounting line according to claim 1 , further comprising:
an inspection controller that obtains an inspection result which is a result of a radiographic inspection conducted to examine a state of the substrate on which the solder and the component are mounted, wherein
the at least one processor is further configured to determine whether the member can be manufactured within the component exposure time t 1 and the solder exposure time s 1 based on a correlation chart indicating a relationship between the elapsed time period and a degree of dewetting of the member, the elapsed time period being a time period that has elapsed until the solder and the component are mounted on the substrate, the degree of dewetting being calculated based on the inspection result.

5. The component mounting line according to claim 4 , wherein
the at least one processor is further configured to obtain, based on the correlation chart, a second threshold value for the elapsed time period, below which the degree of dewetting is less than or equal to a predetermined value, and determines that the member can be manufactured within the component exposure time t 1 and the solder exposure time s 1 when the elapsed time period is less than the second threshold value.

6. The component mounting line according to claim 2 , wherein the at least one processor is further configured to estimate, based on the correlation chart, a use prohibition time which is a time from which a use of the member is prohibited, and output information indicating the use prohibition time, and wherein
the at least one processor is further configured to determines whether the member can be manufactured within the component exposure time t 1 and the solder exposure time s 1 based on the information indicating the use prohibition time.

7. The component mounting line according to claim 2 , further comprising:
a storage that stores a plurality of correlation charts each being associated with a type of the member, the plurality of correlation charts each being the correlation chart.

8. The component mounting line according to claim 1 , further comprising:
an inspection controller that obtains an inspection result which is a result of a radiographic inspection conducted to examine a state of the substrate on which the solder and the component are mounted, wherein the at least one processor is further configured to
generate feature information based on the elapsed time period and a probability of void formation in the solder mounted on the substrate, the feature information indicating a tendency of the probability of void formation that varies each time the solder is mounted on the substrate, the elapsed time period being a time period that has elapsed until the solder and the component are mounted on the substrate, the probability of void formation being calculated based on the inspection result, wherein the at least one processor is further configured to
estimate, based on the feature information, a time from which a use of the member is prohibited.

9. The component mounting line according to claim 1 , further comprising:
an inspection controller that obtains an inspection result which is a result of a radiographic inspection conducted to examine a state of the substrate on which the solder and the component are mounted, wherein the at least one processor is further configured to
generate feature information based on the elapsed time period and a degree of dewetting of the member, the feature information indicating a tendency of the degree of dewetting that varies each time the solder is mounted on the substrate, the degree of dewetting being calculated based on the inspection result, wherein the at least one processor is further configured to
estimate, based on the feature information, a time from which a use of the member is prohibited.

10. The component mounting line according to claim 1 , further comprising:
a solder printing apparatus that prints solder on the substrate; and
an inspection apparatus that conducts a radiographic inspection to examine a state of the member mounted.

11. The component mounting line according to claim 2 , further comprising:
a notifier that notifies that, when a sign predicting that the member cannot be manufactured within the component exposure time t 1 and the solder exposure time s 1 is detected in the inspection result, the sign has been detected.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Ikeda Masanori
• Fukasawa Katsusuke
• Itose Kazuhiko

Classifications

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H05K13/0465

  by soldering (H05K13/0469 takes precedence) · CPC title

• H05K13/083

  Quality monitoring using results from monitoring devices, e.g. feedback loops (H05K13/084 takes precedence) · CPC title

• H05K3/34

  by soldering · CPC title

• H05K13/08

  Monitoring manufacture of assemblages · CPC title