Composite electronic component

Patent metadata

Field	Value
Publication number	US-11289275-B2
Application number	US-202017024927-A
Country	US
Kind code	B2
Filing date	Sep 18, 2020
Priority date	Nov 25, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A composite electronic component includes a composite body including a multilayer ceramic capacitor including a first ceramic body in which dielectric layers and internal electrodes disposed to oppose each other with a respective one of the dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes. A ratio (G1/M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

First claim

What is claimed is:

1. A composite electronic component, comprising:
a composite body including:
a multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to oppose each other with a respective one of the plurality of dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and
a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes,

wherein a ratio (G1/M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

2. The composite electronic component of claim 1 , wherein the length (M1) of the margin portion between the internal electrode and the lower surface of the first ceramic body and the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfy M1<G1.

3. The composite electronic component of claim 1 , wherein the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfies 30 μm≤G1≤120 μm.

4. The composite electronic component of claim 1 , wherein the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfies 50 μm≤G1≤100 μm.

5. The composite electronic component of claim 1 , wherein the internal electrodes in the first ceramic body are layered perpendicularly to amounting surface of the composite body.

6. The composite electronic component of claim 1 , wherein the internal electrodes are layered perpendicularly to the lower surface of the first ceramic body, and
the lower surface of the first ceramic body faces the ceramic chip.

7. The composite electronic component of claim 1 , wherein the multilayer ceramic capacitor and the ceramic chip are bonded to each other by solder or a conductive adhesive applied on upper surfaces of the first terminal electrode and the second terminal electrode.

8. The composite electronic component of claim 1 , wherein the thickness direction is a stacking direction along which the ceramic chip and the multilayer ceramic capacitor are stacked.

9. A composite electronic component, comprising:
a composite body including:
a multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to oppose each other with a respective one of the plurality of dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and
a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes,

wherein a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body and a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction satisfy M1<G1.

10. The composite electronic component of claim 9 , wherein a ratio (G1/M1) of the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction to the length (M1) of the margin portion between the internal electrode and the lower surface of the first ceramic body satisfies 1.0<G1/M1≤2.5.

11. The composite electronic component of claim 9 , wherein the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfies 30 μm≤G1≤120 μm.

12. The composite electronic component of claim 9 , wherein the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfies 50 μm≤G1≤100 μm.

13. The composite electronic component of claim 9 , wherein the internal electrodes in the first ceramic body are layered perpendicularly to amounting surface of the composite body.

14. The composite electronic component of claim 9 , wherein the internal electrodes are layered perpendicularly to the lower surface of the first ceramic body, and
the lower surface of the first ceramic body faces the ceramic chip.

15. The composite electronic component of claim 9 , wherein the multilayer ceramic capacitor and the ceramic chip are bonded to each other by solder or a conductive adhesive applied on upper surfaces of the first terminal electrode and the second terminal electrode.

16. The composite electronic component of claim 9 , wherein the thickness direction is a stacking direction along which the ceramic chip and the multilayer ceramic capacitor are stacked.

Assignees

• Samsung Electro Mech

Inventors

• Son Soo Hwan

Classifications

• H01G4/35 Primary

  Feed-through capacitors or anti-noise capacitors · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title