Sensing device

Patent metadata

Field	Value
Publication number	US-11287399-B2
Application number	US-202016882757-A
Country	US
Kind code	B2
Filing date	May 26, 2020
Priority date	May 27, 2019
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

A sensing device that senses a substance to be sensed as a gas by causing a piezoelectric resonator to adsorb the substance to be sensed, includes: a substrate, a thermoelectric element unit, a support plate, and a base portion. A sensing module unit in which a substrate, a thermoelectric element unit, and a support plate are integrated is removably disposed to a base portion that performs at least one of heat supply and heat dissipation to the thermoelectric element unit.

First claim

What is claimed is:

1. A sensing device that adsorbs a substance to be sensed as a gas to a piezoelectric resonator, changes a temperature of the piezoelectric resonator to desorb the substance to be sensed, and senses the substance to be sensed based on a relationship between a change of an oscillation frequency of the piezoelectric resonator and the temperature, the sensing device comprising:
a substrate that holds the piezoelectric resonator;
a thermoelectric element unit, disposed at a position in contact with the substrate to change the temperature of the piezoelectric resonator;
a support plate that supports the thermoelectric element unit from an opposite side of the position in contact with the substrate; and
a base portion to which the support plate is secured such that a surface on an opposite side of the surface to support the thermoelectric element unit is in contact with the base portion, the base portion performing at least one of heat supply and heat dissipation to the thermoelectric element unit via the support plate,
wherein the substrate, the thermoelectric element unit, and the support plate are integrated to form a sensing module unit removable from the base portion.

2. The sensing device according to claim 1 , wherein
the base portion includes a housing space that houses an oscillator circuit to oscillate the piezoelectric resonator.

3. The sensing device according to claim 2 , further comprising:
a conductive member, removably disposed between an electrode connected to the piezoelectric resonator and an electrode connected to the oscillator circuit, and
the conductive member switching electrical connection and disconnection between the piezoelectric resonator and the oscillator circuit.

4. The sensing device according to claim 1 , wherein
the base portion is connected to a cooling/heating unit that performs at least one of cooling and heating of the base portion.

5. The sensing device according to claim 1 , wherein
the substrate and the thermoelectric element unit are mutually connected via metal nanoparticles, and
the thermoelectric element unit and the support plate are mutually connected via the metal nanoparticles.

6. The sensing device according to claim 1 , further comprising:
a heat conduction sheet, disposed between the base portion and the support plate.

7. The sensing device according to claim 1 , wherein
a connection portion of the substrate and the thermoelectric element unit and a connection portion of the thermoelectric element unit and the support plate each have a fitting structure where one is fitted to the other to perform a positioning.

8. The sensing device according to claim 1 , wherein
the thermoelectric element unit is connected to a center on one surface side of the substrate.

9. The sensing device according to claim 1 , wherein
the thermoelectric element unit is disposed at a position in contact with the substrate at a position opposing the piezoelectric resonator via the substrate.

10. The sensing device according to claim 1 , wherein the thermoelectric element unit includes:
a heating unit, embedded in the substrate; and
a temperature control mechanism, disposed so as to be in contact with the substrate,
wherein the temperature control mechanism having a temperature control range different from a heating temperature range of the substrate by the heating unit.

Assignees

• Nihon Dempa Kogyo Co
• Japan Aerospace Exploration

Inventors

• Kukita Hiroyuki
• Shiobara Tsuyoshi
• Yanagisawa Yuki
• Nakagawa Shohei
• Miyazaki Eiji
• Tsuchiya Yuta

Classifications

• H10W90/00

  Package configurations · CPC title

• G01N29/036

  by measuring frequency or resonance of acoustic waves · CPC title

• G01N29/32

  Arrangements for suppressing undesired influences, e.g. temperature or pressure variations {, compensating for signal noise} · CPC title

• G01N29/2437

  Piezoelectric probes · CPC title

• G01N2291/0426

  Bulk waves, e.g. quartz crystal microbalance, torsional waves · CPC title