Process for producing flexible organic-inorganic laminates

Patent metadata

Field	Value
Publication number	US-11286561-B2
Application number	US-201615559497-A
Country	US
Kind code	B2
Filing date	Mar 15, 2016
Priority date	Mar 25, 2015
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

Processes for producing flexible organic-inorganic laminates are described herein. In particular, a process is provided for producing a laminate comprising at least twice a sequence comprising (a) depositing an inorganic layer by performing 3 to 150 cycles of an atomic layer deposition process, and (b) depositing an organic layer comprising nitrogen by performing 1 to 3 cycles of a molecular layer deposition process.

First claim

The invention claimed is:

1. A laminate comprising at least twice a layer sequence comprising:
(a) an inorganic layer having a thickness of 0.3 nm to 1.5 mm, wherein the inorganic layer comprises an alkyl (semi)metal-containing compound; and
(b) a nitrogen-comprising organic layer having a thickness of 0.1 nm to 3 nm, wherein the nitrogen-comprising organic layer is formed from a nitrogen-containing compound comprising: (i) an aromatic compound selected from the group consisting of benzene, naphthalene, and biphenyl; and (ii) one or two amine functional groups and a hydroxyl functional group.

2. The laminate according to claim 1 wherein the organic layer contains nitrogen in the oxidation state-3.

3. The laminate according to claim 1 wherein the inorganic layer comprises AlO x (OH) y , wherein 0≤x≤1.5; 0≤y≤3 and 2x+y=3.

4. The laminate according to claim 1 wherein the laminate comprises the layer sequence comprising (a) and (b) at least 30 times.

5. A barrier film comprising the laminate according to claim 1 .

6. The barrier film according to claim 5 wherein the barrier film further comprises a polymeric substrate.

7. The barrier film according to claim 5 wherein the barrier film further comprises a planarization layer.

8. The barrier film according to claim 5 , wherein the barrier film is suitable for at least one of encapsulation, packaging, or passivation.

9. An electronic device comprising the barrier film according to claim 5 .

10. A process for producing the laminate of claim 7 , the process comprising at least twice a sequence comprising
(a) depositing an inorganic layer by performing 3 to 150 cycles of an atomic layer deposition process, and
(b) depositing an organic layer comprising nitrogen by performing 1 to 3 cycles of a molecular layer deposition process.

11. The process according to claim 10 wherein a primary amine is used in the molecular layer deposition process to deposit the organic layer.

12. The process according to claim 10 wherein an aromatic amine is used in the molecular layer deposition process to deposit the organic layer.

13. The process according to claim 10 wherein an aromatic amine containing a hydroxyl group is used in the molecular layer deposition process to deposit the organic layer.

14. The process according to claim 10 wherein an Al-containing compound is used in the atomic layer deposition process to deposit the inorganic layer.

15. The process according to claim 10 wherein the sequence comprising (a) and (b) is performed at least 30 times.

Assignees

• Basf Coatings Gmbh

Inventors

• Ahlf Maraike
• Frank Juergen
• Adermann Torben
• Klotz Stephan

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• C23C16/45555

  applied in non-semiconductor technology · CPC title

• C23C16/45529 Primary

  specially adapted for making a layer stack of alternating different compositions or gradient compositions · CPC title

• C23C16/30

  Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides · CPC title

• C23C16/455

  characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber · CPC title