Antenna system for transmitting and receiving mm-wave signal

Patent metadata

Field	Value
Publication number	US-11283151-B2
Application number	US-201816202596-A
Country	US
Kind code	B2
Filing date	Nov 28, 2018
Priority date	Nov 28, 2017
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

First claim

What is claimed is:

1. An electronic device comprising:
a housing including a first plate and a second plate facing a direction opposite the first plate;
an antenna printed circuit board (PCB) including a plurality of layers disposed between the first plate and the second plate;
a conductive plate disposed in a first plane of the PCB between the first plate and the second plate, and being parallel to the second plate;
a wireless communication circuit disposed within the housing, and configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz;
a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated in the PCB,
wherein the first electrical path includes a first portion between the first end and the second end;
a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated in the PCB,
wherein the second electrical path includes a second portion between the third end and the fourth end,
wherein the first portion of the first electrical path and the second portion of the second electrical path are spaced from each other by one or more layers of the plurality of layers of the PCB, extend in parallel with each other and provide electrical coupling between the first portion and the second portion,
wherein the first portion and the second portion are configured to filter a portion of a signal which is transmitted and/or received through the conductive plate, and
wherein a frequency band of the signal to be filtered is determined according to a length of the first portion and the second portion thus coupled; and
a first ground layer disposed in a layer of the PCB between the first portion and the wireless communication circuit;
a second ground layer disposed in a layer of the PCB between the second portion and the conductive plate; and
a plurality of vias disposed on multiple sides of the first and second portions and electronically connecting the first ground layer to the second ground layer.

2. The electronic device of claim 1 , wherein the wireless communication circuit is disposed in a second plane parallel to the second plate and between the first plane and the first plate.

3. The electronic device of claim 1 , wherein
the PCB includes a first surface facing the first plate, a second surface facing the second plate, and comprising the plurality of layers are disposed between the first surface and the second surface,
wherein the wireless communication circuit is mounted on the first surface.

4. The electronic device of claim 3 , wherein the plurality of layers includes a first layer, a second layer disposed between the first layer and the first surface, and a third layer disposed between the first layer and the second surface,
wherein the first portion is disposed between the first layer and the second layer, and
wherein the second portion is disposed between the first layer and the third layer.

5. The electronic device of claim 4 , wherein the conductive plate is disposed between the third layer and the second surface.

6. The electronic device of claim 5 , further comprising:
a first conductive via penetrating a part of the plurality of layers between the first layer and the first surface,
wherein the first conductive via electrically connects the wireless communication circuit and the first portion.

7. The electronic device of claim 6 , further comprising:
a second conductive via penetrating another part of the plurality of layers between the first layer and the second surface,
wherein the second conductive via electrically connects the conductive plate and the second portion.

8. A millimeter wave communication device of an electronic device, comprising:
an antenna printed circuit board (PCB) including a plurality of layers;
an integrated circuit (IC) positioned under the antenna PCB;
a first feed line electrically connected with the IC and extending to a first layer of the plurality of layers through one or more of the plurality of layers of the antenna PCB, wherein a first portion of the first feed line is disposed in the first layer and has a first length;
a second feed line including a second portion spaced from the first portion of the first feed line and disposed in a second layer of the plurality of layers of the antenna PCB so as to be electrically coupled with the first portion of the first feed line, the second layer being an upper layer of the first layer and coupled to the first layer directly or via one or more of the plurality of layers;
a first antenna element electrically connected with the second feed line in a third layer of the antenna PCB, the third layer being an upper layer of the second layer,
wherein the IC is configured to transmit and/or receive a millimeter wave (mm-wave) signal using the first feed line, the second feed line, and the first antenna element,
wherein the first portion and the second portion are configured to filter a portion of a signal which is transmitted and/or received through the first antenna element, and
wherein a frequency band of the signal to be filtered is determined according to a length of the first portion and the second portion thus coupled;
a first ground layer disposed in a layer of the PCB between the first portion and the IC;
a second ground layer disposed in a layer of the PCB between the second portion and the first antennal element; and
a plurality of vias disposed on multiple sides of the first and second portions and electronically connecting the first ground layer to the second ground layer.

9. The millimeter wave communication device of claim 8 , further comprising:
a parasitic antenna element disposed in an uppermost layer above the third layer.

10. The millimeter wave communication device of claim 8 , further comprising:
a third feed line electrically connected with the IC and extending to the first layer, wherein a third portion of the third feed line is disposed in the first layer;
a fourth feed line disposed to be coupled with the third portion, which is positioned in the first layer, of the third feed line in the second layer; and
a second antenna element electrically connected with the fourth feed line in the third layer.

11. The millimeter wave communication device of claim 8 , further comprising:
a third feed line electrically connected with the IC and extending to the first layer, wherein a third portion of the third feed line is disposed in the first layer; and
a fourth feed line disposed to be coupled with the third portion, which is positioned in the first layer, of the third feed line in the second layer, wherein the fourth feed line is configured to be opened or to be connected to a ground area.

12. The millimeter wave communication device of claim 8 , further comprising:
a third feed line electrically connected with the IC and extending to the first layer, wherein a third portion of the third feed line is disposed in the first layer; and
a fourth feed line disposed to be coupled with the third portion, which is positioned in the first layer, of the third feed line in the second layer, wherein the fourth feed line is configured to be electrically connected with a variable capacitor.

13. The millimeter wave communication device of claim 12 , wherein the variable capacitor comprises a varactor.

14. The millimeter wave communication device of claim 8 , wherein the second feed line is electrically connected with the first antenna element and extends to the second layer through one or more of the plurality of layers of the antenna PCB, and

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Ji Hoon
• Kim Ji Yong
• Lee Jong In
• Kim Yeon Jeong
• An Yong Jun
• Na Hyo Seok

Classifications

• H10W44/248

  for antennas · CPC title

• H10W44/216

  Waveguides, e.g. strip lines · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01Q9/0414

  in a stacked or folded configuration · CPC title