Embedded millimeter-wave phased array module

Patent metadata

Field	Value
Publication number	US-9773742-B2
Application number	US-201314132729-A
Country	US
Kind code	B2
Filing date	Dec 18, 2013
Priority date	Dec 18, 2013
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

First claim

What is claimed is:

1. An electronic device for generating or receiving signals comprising:
a first set of substrate layers comprising a first material;
a signal generating/receiving circuit embedded in the first set of substrate layers;
a second set of substrate layers coupled to the first set of substrate layers, the second set of substrate layers comprising a second material having a lower electrical loss than the first material, the second set of substrate layers further comprising a plurality of antenna elements coupled through vias to the signal generating/receiving circuit;
a first ground plane that couples the first set of substrate layers to the second set of substrate layers, and
a second ground plane in the second set of substrate layers and separated from the first ground plane by a plurality of substrate layers that are in the second set of substrate layers, wherein the first and second ground planes are on opposite sides of a routing trace layer between the plurality of substrate layers.

2. The electronic device of claim 1 wherein the first material comprises one of an Ajinomoto Build-up Film (ABF) or an epoxy dielectric material.

3. The electronic device of claim 1 wherein the second material comprises one of a liquid crystal polymer (LCP) or low temperature co-fired ceramic (LTCC).

4. The electronic device of claim 1 wherein only the second set of substrate layers comprises mm-wave substrate material.

5. The electronic device of claim 1 wherein the signal generating/receiving circuit comprises a millimeter-wave radio integrated circuit.

6. The electronic device of claim 5 wherein the signal generating/receiving circuit comprises two or more separate dies.

7. The electronic device of claim 6 wherein the two or more separate dies comprise a radio frequency integrated circuit and a baseband integrated circuit.

8. The electronic device of claim 1 wherein the signal generating/receiving circuit is internally coupled to a substrate layer of the first set of substrate layers.

9. The electronic device of claim 1 wherein the plurality of antenna elements comprise:
a first layer of antenna elements coupled to the signal generating/receiving circuit through the vias; and
a second layer of antenna elements separated from the first layer by a substrate layer and capacitively coupled to the first layer of antenna elements.

10. The electronic device of claim 1 wherein the first set of substrate layers is coreless.

11. The electronic device of claim 1 , wherein the plurality of antenna elements comprise a phased array antenna.

12. A phased array module comprising:
a set of lower substrate layers comprising a plurality of substrates of a first material, each substrate separated from an adjacent substrate by a low frequency signal layer and/or power supply layer;
a radio integrated circuit embedded in a first substrate of the set of lower substrate layers and coupled to the low frequency signal layer and/or the power supply layer through a plurality of vias;
a set of upper substrate layers coupled to the set of lower substrate layers with a first ground plane, the set of upper substrate layers comprising a plurality of substrates of a second material having a lower electrical loss than the first material, each substrate separated from an adjacent substrate by a high frequency signal layer for conducting signals having a higher frequency than the lower frequency signal layer;
a plurality of layers of antenna elements coupled to the set of upper substrate layers, at least one layer of antenna elements operably coupled to the radio integrated circuit through a plurality of vias; and
a second ground plane in the set of upper substrate layers and separated from the first ground plane by at least a routing trace layer between a pair of adjacent upper substrate layers.

13. The phase array module of claim 12 wherein the set of lower substrate layers is separated from the set of upper substrate layers by a ground plane.

14. The phase array module of claim 12 wherein the first substrate is located adjacent to the set of upper substrate layers.

15. The phase array module of claim 14 wherein the set of lower substrate layers is coupled to the set of upper substrate layers by a row of solder balls and the radio integrated circuit is embedded into the first substrate layer adjacent to the row of solder balls.

Assignees

• Intel Corp

Inventors

• Kamgaing Telesphor
• Elsherbini Adel
• Rao Valluri

Classifications

• H01Q23/00

  Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title

• H01Q21/0093

  Monolithic arrays · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title