Curing reactive silicone gel and use thereof

Patent metadata

Field	Value
Publication number	US-11279827-B2
Application number	US-201716607012-A
Country	US
Kind code	B2
Filing date	Sep 20, 2017
Priority date	Sep 26, 2016
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

A curing reactive silicone gel is provided. The curing reactive silicone gel is obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity. (A) an organopolysiloxane having at least two curing reactive groups in one molecule; (B) optionally, an organohydrogenpolysiloxane; and (C) a curing agent.

First claim

The invention claimed is:

1. A curing reactive silicone gel obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity:
(A) an organopolysiloxane having at least two curing reactive groups in one molecule;
(B) optionally, an organohydrogenpolysiloxane; and
(C) a curing agent;
wherein the curing reactive silicone gel has a loss factor (tan δ) in the range of 0.01 to 1.00 at 23° C. to 100° C. when measured at a frequency of 0.1 Hz.

2. The curing reactive silicone gel according to claim 1 , which has a loss factor (tan δ) in the range of 0.03 to 0.95 at 23° C. to 100° C. when measured at a frequency of 0.1 Hz.

3. The silicone gel according to claim 1 , wherein a storage modulus (G′ cured ) of a cured product of the curing reactive silicone gel obtained by a curing reaction is at least 100% larger than a storage modulus (G′ gel ) of a silicone gel layer before curing.

4. The curing reactive silicone gel according to claim 1 , which contains one or more curing agents selected from hydrosilylation reaction catalysts, peroxides, and photopolymerization initiators.

5. The curing reactive silicone gel according to claim 1 , wherein the primarily curing is carried out in a temperature range of room temperature to 80° C.

6. The curing reactive silicone gel according to claim 1 , which is secondarily curing reactive to heating, irradiation with high energy rays, or a combination thereof.

7. The curing reactive silicone gel according to claim 1 , wherein component (A) is a mixture of:
(A-1) a linear organopolysiloxane having at least two curing reactive groups in one molecule; and
(A-2) a resinous or branched chain organopolysiloxane having at least two curing reactive groups in one molecule.

8. The curing reactive silicone gel according to claim 1 , wherein:
component (A) is a mixture of;
(A-1) a linear organopolysiloxane having at least two alkenyl groups or photopolymerizable functional groups in one molecule, and
(A-2) a resinous or branched chain organopolysiloxane having at least two alkenyl groups or photopolymerizable functional groups in one molecule;
component (B) is an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule;
component (C) is a curing reaction catalyst containing hydrosilylation reaction catalyst; and
the silicon atom-bonded hydrogen atoms in component (B) are in the range of 0.25 mol or more with regard to 1 mol of the alkenyl groups in components (A-1) and (A-2) of the composition.

9. The curing reactive silicone gel according to claim 1 , which is in the form of a film or sheet having an average thickness in the range of 10 to 500 μm.

10. An adhesive comprising the curing reactive silicone gel according to claim 1 .

11. An electronic component comprising the adhesive of claim 10 .

12. A protective agent or a sealant comprising the curing reactive silicone gel according to claim 1 .

13. An electronic component comprising the protective agent or the sealant of claim 12 .

14. An electronic component comprising a cured product of the curing reactive silicone gel according to claim 1 .

15. A member for manufacturing an electronic component, comprising a cured product of the curing reactive silicone gel according to claim 1 .

Assignees

• Dow Corning Toray Co Ltd
• Dow Toray Co Ltd

Inventors

• Fukui Hiroshi
• TOYAMA Kyoko
• Dogen Ryota
• Ushio Yoshito

Classifications

• H10W76/47

  Solid or gel fillings · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• C09K3/1018

  Macromolecular compounds having one or more carbon-to-silicon linkages · CPC title

• C09J183/04

  Polysiloxanes · CPC title

• C08G77/20 Primary

  containing silicon bound to unsaturated aliphatic groups · CPC title