Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device

Patent metadata

Field	Value
Publication number	US-2016208138-A1
Application number	US-201414912739-A
Country	US
Kind code	A1
Filing date	Aug 27, 2014
Priority date	Aug 28, 2013
Publication date	Jul 21, 2016
Grant date	—

Abstract

The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

First claim

1 . A curable silicone composition comprising:
(A) a diorganopolysiloxane having at least two alkenyl groups in a molecule and containing siloxane units represented by the formula: R 1 2 SiO 2/2 (wherein each R 1 independently represents an aryl group; (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights based on standard polystyrene conversion gel permeation chromatography, and each comprising siloxane units represented by the formula: SiO 4/2 , siloxane units represented by the formula: R 2 2 R 3 SiO 1/2 (wherein each R 2 independently represents a monovalent hydrocarbon group lacking aliphatic unsaturated bonds and each R 3 independently represents an alkenyl group, and siloxane units represented by the formula: R 2 3 SiO 1/2 (wherein R 2 has the same significance is as defined above, in an amount of 10 to 100 parts by mass per 100 parts by mass of component (A); (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount so that the amount of silicon-bonded hydrogen atoms in component (C) is from 0.1 to 10 mol per 1 mol of total alkenyl groups in components (A) and (B); and (D) a catalytic amount of hydrosilylation reaction catalyst.

2 . The curable silicone composition of claim 1 , wherein component (A) is an organopolysiloxane represented by the general formula:

(wherein each R 1 independently represents aryl groups, each R 3 independently represents alkenyl groups, each R 4 independently represents monovalent hydrocarbon groups, each R 5 independently represents monovalent hydrocarbon groups lacking aryl groups, and m represents an integer of 1 to 800, n represents an integer of 1 to 400, m≧n, and 5≦m+n≦1,000.

3 . The curable silicone composition of claim 1 , wherein component (B) constitutes at least two types of resinous organopolysiloxanes in which the difference in their mass average molecular weights is at least 1,000.

4 . The curable silicone composition of claim 1 , further comprising (E) a cerium-containing organopolysiloxane, in an amount that cerium atoms in component (E) is 10 to 2,000 ppm in mass units relative to the curable silicone composition.

5 . The curable silicone composition of claim 1 , further comprising (F) a hydrosilylation reaction inhibitor, in an amount of 0.01 to 3 parts by mass per a total 100 parts by mass of components (A) to (C).

6 . The curable silicone composition of claim 1 , further comprising (G) an adhesion promoter, in an amount of 0.01 to 10 parts by mass per a total 100 parts by mass of components (A) to (C).

7 . The curable silicone composition of claim 1 , further comprising (H) a fluorescent substance, in an amount of 0.1 to 70% by mass of the curable silicone composition.

8 . A cured product produced by curing the curable silicone composition according to claim 1 .

9 . An optical semiconductor device comprising an optical semiconductor element sealed with a cured product of the curable silicone composition according to claim 1 .

10 . The curable silicone composition of claim 2 , wherein component (B) constitutes at least two types of resinous organopolysiloxanes in which the difference in their mass average molecular weights is at least 1,000.

Assignees

• Dow Corning Toray Co Ltd

Inventors

• Nishijima Kazuhiro
• Iimura Tomohiro
• Suto Michitaka
• Sagawa Takashi
• Furukawa Haruhiko

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• C08K5/56

  Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title