Amorphous thin metal film

Patent metadata

Field	Value
Publication number	US-11279129-B2
Application number	US-201616067945-A
Country	US
Kind code	B2
Filing date	Jun 24, 2016
Priority date	Jun 24, 2016
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at % to 90 at % of cerium. The three elements may account for at least 50 at % of the amorphous thin metal film.

First claim

What is claimed is:

1. An amorphous thin metal film, comprising:
5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum; and
1 at % to 90 at % of cerium,
wherein the metalloid, the first metal, and cerium account for at least 50 at % of the amorphous thin metal film.

2. The amorphous thin metal film of claim 1 , further comprising 5 at % to 90 at % of a second metal, wherein the second metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum, and wherein the first metal and the second metal are different metals, and wherein the metalloid, the first metal, the second metal, and cerium account for at least 70 at % of the amorphous thin metal film.

3. The amorphous thin metal film of claim 2 , wherein the first metal, the second metal, or both include a refractory metal selected from titanium, vanadium, chromium, zirconium, niobium, molybdenum, ruthenium, rhodium, hafnium, tantalum, tungsten, osmium, or iridium.

4. The amorphous thin metal film of claim 1 , wherein the amorphous thin metal film has a thickness ranging from 10 angstroms to 100 microns.

5. The amorphous thin metal film of claim 1 , further comprising 0.1 at % to 25 at % of a dopant, wherein the dopant is nitrogen, oxygen, or a mixture thereof.

6. The amorphous thin metal film of claim 1 , wherein the amorphous thin metal film has a surface RMS roughness of less than 1 nm.

7. A method, comprising depositing the amorphous thin metal film to a substrate, the amorphous thin metal film, comprising:
5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum; and
1 at % to 90 at % of cerium,
wherein the metalloid, the first metal, and cerium account for at least 50 at % of the amorphous thin metal film.

8. The method of claim 7 , wherein the amorphous thin metal film further comprises a second metal, wherein the second metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum, and wherein the first metal and the second metal are different.

9. The method of claim 7 , wherein the depositing includes sputtering.

10. A thermal inkjet printhead stack with an amorphous thin metal film, comprising:
an insulated substrate;
a resistor applied to the insulated substrate;
a resistor passivation layer applied to the resistor; and
a protective layer applied to the resistor passivation layer,
wherein the resistor, the protective layer, or both include the amorphous thin metal film, said amorphous thin metal film, comprising:
5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum; and
1 at % to 90 at % of cerium,
wherein the metalloid, the first metal, and cerium account for at least 50 at % of the amorphous thin metal film.

11. The thermal inkjet printhead stack of claim 10 , wherein the resistor comprises the amorphous thin metal film.

12. The thermal inkjet printhead stack of claim 11 , wherein the resister is applied at a thickness ranging from 0.02 microns to 0.5 microns.

13. The thermal inkjet printhead stack of claim 10 , wherein the protective layer comprises the amorphous thin metal film.

14. The thermal inkjet printhead stack of claim 13 , wherein the protective layer is applied at a thickness ranging from 0.02 microns to 2 microns.

15. The thermal inkjet printhead stack of claim 10 , wherein both the resistor and the protective layer are the amorphous thin metal film, and wherein the resistor and the protective layer are either compositionally identical or compositionally different.

Assignees

• Hewlett Packard Development Co
• The State Of Oregon State Board Of Higher Education On Behalf Of Oregon State Univ
• Univ Oregon State

Inventors

• Abbott Jr James Elmer
• Mcglone John M
• Olsen Kristopher
• Keszler Douglas A
• Wager John
• Pugliese Roberto A
• Stickle William F
• Long Greg Scott

Classifications

• H01B5/02

  Single bars, rods, wires, or strips · CPC title

• C22C45/00

  Amorphous alloys (making amorphous non-ferrous alloys C22C1/11) · CPC title

• B41J2/14129 Primary

  Layer structure · CPC title

• B32B15/00

  Layered products comprising {a layer of} metal · CPC title

• B41J2202/03

  Specific materials used · CPC title