Method for mechanical contacting of a potting frame on a printed circuit board

Patent metadata

Field	Value
Publication number	US-11277920-B2
Application number	US-201816755112-A
Country	US
Kind code	B2
Filing date	Sep 11, 2018
Priority date	Oct 10, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

First claim

The invention claimed is:

1. A method for a mechanical connecting of a potting frame to a printed circuit board of an electrical/electronic module, wherein the potting frame has at least one metal contact area, and wherein the printed circuit board includes a surface area metallically corresponding to the at least one metal contact area, and wherein the potting frame serves for potting electrical/electronic components within the surface area, the method comprising:
positioning the potting frame with the at least one metal contact area facing the corresponding surface area;
soldering the potting frame to the printed circuit board via the at least one metal contact area and the surface area and soldering the electrical/electronic components to the printed circuit board, wherein the soldering of the potting frame and the soldering of the electrical/electronic components are done together in a same process step; and
potting the electrical/electronic components within the potting frame.

2. The method as claimed in claim 1 , wherein a reflow soldering method is applied for the step of soldering the at least one metal contact area to the surface area and the electrical/electronic components to the printed circuit board.

3. The method as claimed in claim 1 ,
wherein the at least one metal contact area of the potting frame and the surface area of the printed circuit board are designed in such a manner relative to one another, including by mutually engaging means, in order to secure positioning of the potting frame before the soldering to the printed circuit board.

4. The method as claimed in claim 1 , wherein the potting frame including the at least one metal contact area is produced by an MID method, including by laser direct structuring.

5. The method as claimed in claim 1 , wherein the potting of the electrical/electronics components within the potting frame explosion safely encapsulates the electrical/electronic components according to the series of standards, EN 60079.

6. The method as claimed in claim 1 ,
wherein the at least one metal contact area extends along an entire perimeter of the potting frame, and
wherein the surface area on the printed circuit board corresponding to the at least one metal contact area is a conductive trace on the printed circuit board having a same size and shape as the at least one metal contact area.

Assignees

• Endress Hauser Se Co Kg

Inventors

• Strütt Bernd
• Gerwig Simon
• Bauer Max

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title