Poly(amic acid), poly(amic acid) solution, polyimide, polyimide film, layered product, flexible device, and production method for polyimide film

Patent metadata

Field	Value
Publication number	US-11274182-B2
Application number	US-201816611496-A
Country	US
Kind code	B2
Filing date	May 2, 2018
Priority date	May 11, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A polyamic acid that has a fluorine atom content of 25 wt % or less and an amount of a fluorine-containing diamine in the polyamic acid is 70 mol % or more with respect to 100 mol % of a sum of diamine components. The total number of moles of tetracarboxylic acid component in the polyamic acid is 0.960 times or more and less than 1.000 time total number of moles of diamine component. The polyamic acid preferably has the structural unit represented by formula (1) and the structural unit represented by formula (2). The polyamic acid may contain trans-1,4-cyclohexanediamine as the diamine component.

First claim

The invention claimed is:

1. A polyamic acid that is a polyaddition product of a diamine and tetracarboxylic dianhydride, wherein
a fluorine atom content of the polyamic acid is 25 wt % or less,
an amount of a fluorine-containing diamine component is 70 mol % or more with respect to 100 mol % of a total amount of a diamine component in the polyamic acid,
the polyamic acid comprises a first structural unit represented by the Formula (1) and a second structural unit represented by the Formula (2),
a total number of moles of a tetracarboxylic dianhydride component is 0.960 times to less than 1.000 time a total number of moles of the diamine component, and
the diamine component comprises 1 to 30 mol % of trans-1,4-cyclohexanediamine:

2. The polyamic acid according to claim 1 , wherein a total amount of the first structural unit and the second structural unit is 70 mol % or more.

3. A polyamic acid solution, comprising:
the polyamic acid according to claim 1 ; and
an organic solvent.

4. A polyimide that is a cyclodehydration product of the polyamic acid according to claim 1 .

5. A polyimide film, comprising:
the polyimide according to claim 4 .

6. The polyimide film according to claim 5 , wherein a haze of the polyimide film is 1% or less, and a coefficient of thermal expansion of the polyimide film when a temperature rises from 100° C. to 300° C. is 15 ppm/K or less.

7. The polyimide film according to claim 5 , wherein a yellow index of the polyimide film is 10 or less.

8. A laminate, comprising:
a support; and
the polyimide film according to claim 5 disposed on the support.

9. A flexible device, comprising:
the polyimide film according to claim 5 ; and
an electronic element disposed on the polyimide film.

10. A method for manufacturing a polyimide film, comprising:
applying the polyamic acid solution according to claim 3 onto a support, thereby forming a laminate comprising a film-shaped polyamic acid on the support; and
heating the laminate to imidize the polyamic acid.

11. The method of claim 10 , further comprising:
peeling off the support from the polyimide film formed by the imidization of the polyamic acid.

12. The polyamic acid according to claim 1 , wherein an amount of the first structural unit is 10 to 90 mol % with respect to 100 mol % of a total amount of the first structural unit and the second structural unit.

13. The polyamic acid according to claim 1 wherein a total amount of the first structural unit and the second structural unit is 90 mol % or more.

14. The polyamic acid according to claim 1 , wherein the fluorine atom content of the polyamic acid is from 5 wt % to 25 wt %.

15. The polyamic acid according to claim 1 , wherein the fluorine atom content of the polyamic acid is from 17 wt % to 21 wt %.

16. The polyamic acid according to claim 1 , wherein the total number of moles of tetracarboxylic dianhydride component is 0.970 to 0.999 times the total number of moles of the diamine component.

17. The polyamic acid according to claim 1 , wherein the total number of moles of tetracarboxylic dianhydride component is 0.980 to 0.998 times the total number of moles of the diamine component.

18. The polyamic acid according to claim 1 , having a weight average molecular weight of 10,000 to 200,000.

Assignees

• Kaneka Corp

Inventors

• Nakayama Hirofumi
• Uno Mari

Classifications

• C08G73/1007 Primary

  from tetracarboxylic acids or derivatives and diamines · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• H05K1/0346

  containing N · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title