Polyimide resin

Patent metadata

Field	Value
Publication number	US-2016137789-A1
Application number	US-201414899222-A
Country	US
Kind code	A1
Filing date	Jul 3, 2014
Priority date	Jul 5, 2013
Publication date	May 19, 2016
Grant date	—

Abstract

A polyimide resin contains repeating structural units represented by formulas (1) and (2), wherein the content of the repeating structural unit represented by formula (2) relative to the total of the repeating structural unit represented by formula (1) and the repeating structural unit represented by formula (2) falls within a specific range and the content of the divalent group represented by the following structural formula (B1) falls within a specific range:

X 1 represents a tetravalent group containing an alicyclic hydrocarbon structure and having a carbon number of from 4 to 22. X 2 represents a tetravalent group containing an aromatic ring and having a carbon number of from 6 to 22. R 1 and R 2 each independently represent a divalent organic group, and the content of the divalent group represented by the following structural formula (B1) relative to the total of R 1 and R 2 is from 80 to 100 mol %:

First claim

1 . A polyimide resin comprising a repeating structural unit represented by the following general formula (1) and a repeating structural unit represented by the following general formula (2), wherein the content of the repeating structural unit represented by the general formula (2) relative to the total of the repeating structural unit represented by the general formula (1) and the repeating structural unit represented by the general formula (2) is from 35 to 75 mol %:

wherein X 1 represents a tetravalent group comprising an alicyclic hydrocarbon structure and having a carbon number of from 4 to 22; X 2 represents a tetravalent group comprising an aromatic ring and having a carbon number of from 6 to 22; R 1 and R 2 each independently represent a divalent organic group, and the content of the divalent group represented by the following structural formula (B1) relative to the total of R 1 and R 2 is from 80 to 100 mol %:

2 . The polyimide resin according to claim 1 , wherein the content of the repeating structural unit represented by the general formula (2) relative to the total of the repeating structural unit represented by the general formula (1) and the repeating structural unit represented by the general formula (2) is from 35 to 65 mol %.

3 . The polyimide resin according to claim 1 , wherein X 1 represents at least one selected from tetravalent groups represented by the following general formulae (X1-1) and (X1-2):

wherein R 3 to R 8 each independently represent a hydrogen atom, a halogen atom, an alkyl group having a carbon number of from 1 to 6, or a halogenoalkyl group.

4 . The polyimide resin according to claim 3 , wherein X 1 is a tetravalent group represented by the general formula (X1-1).

5 . The polyimide resin according to claim 1 , 1 , wherein X 2 is at least one selected from tetravalent groups represented by the following general formulae (X2-1) to (X2-3):

wherein R 9 to R 20 each independently represent a hydrogen atom, a halogen atom, an alkyl group having a carbon number of from 1 to 6, or a halogenoalkyl group, and R 21 represents a single bond, —CH 2 —, —C(CH 3 ) 2 —, —O—, —S—, —SO 2 —, —CONH—, —CO—, or —C(CF 3 ) 2 —.

6 . The polyimide resin according to claim 5 , wherein X 2 is a tetravalent group represented by the following structural formula (X2-4):

7 . The polyimide resin according to claim 1 , wherein the repeating structural unit represented by the general formula (1) and the repeating structural unit represented by the general formula (2) contains a divalent organic group having a phenolic structure as the divalent organic group represented by R 1 and R 2 .

8 . The polyimide resin according to claim 7 , wherein the divalent organic group having a phenolic structure is a divalent group represented by the following general formula (B2):

wherein R 22 to R 27 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having a carbon number of from 1 to 6, or a halogenoalkyl group; R 28 represents a single bond, —CH 2 —, —C(CH 3 ) 2 —, —O—, —S—, —SO 2 —, —CONH—, —CO—, or —C(CF 3 ) 2 —.

9 . The polyimide resin according to claim 7 , wherein the content of the divalent organic group having a phenolic structure in the polyimide resin is more than 0 mol % and 20 mol % or less, relative to the total of R 1 and R 2 in the general formula (1) and the general formula (2).

10 . A polyamide acid that is a precursor of the polyimide resin of claim 1 .

11 . A resin composition comprising the polyimide resin of claim 1 and silica microparticles.

12 . The resin composition according to claim 11 , wherein the content ratio by mass of the polyimide resin to the silica microparticles is from 20/80 to 95/5.

13 . The resin composition according to claim 11 , wherein the mean particle size of the silica microparticles is from 1 to 100 nm.

14 . A polyimide film comprising the polyimide resin of claim 1 .

15 . The polyimide film according to claim 14 , which has a total light transmittance of 85% or more when the film polyimide has a thickness of 30 μm.

16 . A laminate comprising a substrate selected from plastic film, silicon wafer, metal foil and glass, and a polyimide resin layer containing the polyimide resin of claim 1 .

17 . The laminate according to claim 16 , wherein the substrate is copper foil.

18 . The polyimide resin according to claim 8 , wherein the content of the divalent organic group having a phenolic structure in the polyimide resin is more than 0 mol % and 20 mol % or less, relative to the total of R 1 and R 2 in the general formula (1) and the general formula (2).

19 . The resin composition according to claim 12 , wherein the mean particle size of the silica microparticles is from 1 to 100 nm.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Suenaga Shuya
• Matsumaru Teruhisa

Classifications

• B32B2307/412

  Transparent · CPC title

• C08G73/1039

  comprising halogen-containing substituents · CPC title

• B32B2307/306

  Resistant to heat · CPC title

• C08K3/36

  Silica · CPC title

• C09D179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title