Vibrating barrel polishing method and vibrating barrel polishing system

US11273532B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11273532-B2
Application numberUS-201716088935-A
CountryUS
Kind codeB2
Filing dateMar 24, 2017
Priority dateMar 28, 2016
Publication dateMar 15, 2022
Grant dateMar 15, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In one embodiment, a vibration barrel polishing method using a vibration barrel polishing system that includes a polishing tank having a bottom surface therein and a polishing jig capable of holding a workpiece and rotatable around a rotation axis is provided. This method includes a step of supporting the polishing jig in the polishing tank in a state in which a lowermost portion of the polishing jig is separated from the bottom surface, a clearance d between the lowermost portion of the polishing jig and the bottom surface being greater than or equal to a grain diameter of a polishing medium, a step of causing the polishing medium to flow in the polishing tank, and a step of rotating the polishing jig around the rotation axis in the state in which the lowermost portion of the polishing jig is separated from the bottom surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A vibration barrel polishing method using a vibration barrel polishing system that includes a polishing tank having a bottom surface therein and a polishing jig capable of holding a workpiece and rotatable around a rotation axis, the vibration barrel polishing method comprising steps of: supporting the polishing jig in the polishing tank in a state in which a lowermost portion of the polishing jig is separated from the bottom surface by a clearance d; causing the polishing medium to flow in the polishing tank; and rotating the polishing jig around the rotation axis in the state in which the lowermost portion of the polishing jig is separated from the bottom surface by the clearance d and an uppermost portion of the polishing jig is disposed above a surface of the polishing medium, wherein the clearance d is equal to or greater than a grain diameter of the polishing medium and equal to or smaller than (H 1 +H 2 )/4, wherein H 1 represents a maximum height of the surface of the polishing medium flowing in the polishing tank with respect to the bottom surface and H 2 represents a minimum height thereof in a cross-sectional view along a plane orthogonal to the rotation axis and passing through a center of the bottom surface. 2. The vibration barrel polishing method according to claim 1 , wherein the workpiece has a flat shape. 3. The vibration barrel polishing method according to claim 2 , wherein the polishing jig includes a first guard member and a second guard member disposed to face each other through an accommodation space, a contour shape of the first guard member and the second guard member having a disc shape larger than the workpiece, and a fixing member configured to fix the workpiece in the accommodation space such that the entire workpiece is located inside the accommodation space, a window portion communicating with the accommodation space is formed in each of the first guard member and the second guard member, and the polishing medium is allowed to pass between an inside and an outside of the accommodation space through the window portion and an opening between an outer edge of the first guard member and an outer edge of the second guard member. 4. The vibration barrel polishing method according to claim 1 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the polishing jig is rotated in the same direction as a flow direction of the polishing medium in the step of rotating the polishing jig around the rotation axis. 5. The vibration barrel polishing method according to claim 1 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the step of rotating the polishing jig around the rotation axis includes a step of rotating the polishing jig in the same direction as a flow direction of the polishing medium and a step of rotating the polishing jig in an opposite direction of the flow direction of the polishing medium. 6. The vibration barrel polishing method according to claim 2 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the polishing jig is rotated in the same direction as a flow direction of the polishing medium in the step of rotating the polishing jig around the rotation axis. 7. The vibration barrel polishing method according to claim 3 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the polishing jig is rotated in the same direction as a flow direction of the polishing medium in the step of rotating the polishing jig around the rotation axis. 8. The vibration barrel polishing method according to claim 2 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the step of rotating the polishing jig around the rotation axis includes a step of rotating the polishing jig in the same direction as a flow direction of the polishing medium and a step of rotating the polishing jig in an opposite direction of the flow direction of the polishing medium. 9. The vibration barrel polishing method according to claim 3 , wherein the polishing medium is caused to flow to draw an arc-shaped trajectory inside the polishing tank in the step of causing the polishing medium to flow in the polishing tank, and the step of rotating the polishing jig around the rotation axis includes a step of rotating the polishing jig in the same direction as a flow direction of the polishing medium and a step of rotating the polishing jig in an opposite direction of the flow direction of the polishing medium. 10. The vibration barrel polishing method according to claim 1 , wherein the vibration barrel polishing system further comprising: a positioning unit configured to change a position of the polishing jig in a height direction; a rotating unit configured to rotate the polishing jig around the rotation axis; and a moving unit configured to move the positioning unit and the rotating unit along a horizontal direction, and the vibration barrel polishing method further comprising moving the positioning unit and the rotating unit in the horizontal direction by the moving portion so that the polishing jig is disposed above the polishing tank. 11. A vibration barrel polishing system comprising: a polishing tank having a bottom surface; a rotating shaft configured to rotate about an axis to vibrate the polishing tank; a polishing jig configured to hold a workpiece; a positioning unit configured to support the polishing jig in the polishing tank, the positioning unit being capable of changing a position of the polishing jig in a height direction; a rotating unit configured to rotate the polishing jig around a rotation axis; and a controller configured to control the rotating shaft, the positioning unit and the rotating unit, wherein the controller is configured to: control the positioning unit so that the polishing jig is disposed at a position where a lowermost portion of the polishing jig is separated from the bottom surface by a clearance d; rotate the rotating shaft so that a polishing medium flows in the polishing tank by vibration of the polishing tank; and control the rotating unit to rotate the polishing jig in a state in which a lowermost portion of the polishing jig is separated from the bottom surface by the clearance d and an uppermost portion of the polishing jig is disposed above a surface of the polishing medium, and wherein the clearance d is equal to or greater than a grain diameter of the polishing medium and equal to or smaller than (H 1 +H 2 )/4, wherein H 1 represents a maximum height of the surface of the polishing medium flowing in the polishing tank with respect to the bottom surface and H 2 represents a minimum height thereof in a cross-sectional view along a plane orthogonal to the rotation axis and passing through a center of the bottom surface. 12. The vibration barrel polishing system according to claim 11 , further comprising: a moving unit configured to move the polishing jig along a horizontal direction, wherein the positioning unit, the rotating unit, and the moving unit are integrally provided.

Assignees

Inventors

Classifications

  • B24B31/003Primary

    whereby the workpieces are mounted on a holder and are immersed in the abrasive material · CPC title

  • the workpieces being fitted on a support · CPC title

  • Frames; Beds; Carriages · CPC title

  • subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) · CPC title

  • involving a bowl formed as a straight through · CPC title

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What does patent US11273532B2 cover?
In one embodiment, a vibration barrel polishing method using a vibration barrel polishing system that includes a polishing tank having a bottom surface therein and a polishing jig capable of holding a workpiece and rotatable around a rotation axis is provided. This method includes a step of supporting the polishing jig in the polishing tank in a state in which a lowermost portion of the polishi…
Who is the assignee on this patent?
Sintokogio Ltd
What technology area does this patent fall under?
Primary CPC classification B24B31/003. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).