Ultrasonic Peening-Type Integrated Machining Method Of Cutting And Extrusion
US-2020346313-A1 · Nov 5, 2020 · US
subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00)
subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B1/04 |
| Official title | subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) |
| Display label | subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) |
| Total patents | 134 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 9 |
| 2017 | 4 |
| 2018 | 9 |
| 2019 | 17 |
| 2020 | 16 |
| 2021 | 17 |
| 2022 | 9 |
| 2023 | 17 |
| 2024 | 12 |
| 2025 | 15 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Masking tool system and method
US-10792781-B2 · Oct 6, 2020 · US
Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US-2020308041-A1 · Oct 1, 2020 · US
Additives to improve particle dispersion for cmp slurry
US-2020308451-A1 · Oct 1, 2020 · US
Additive manufactured conglomerated powder removal from internal passages
US-10737363-B2 · Aug 11, 2020 · US
Dummy disk, dressing disk, and surface height measurement method using dummy disk
US-2020246936-A1 · Aug 6, 2020 · US
Airfoil machine components polishing method
US-10722996-B2 · Jul 28, 2020 · US
Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US-10717669-B2 · Jul 21, 2020 · US
Wafer thinning systems and related methods
US-10685863-B2 · Jun 16, 2020 · US
Gettering layer forming apparatus, gettering layer forming method and computer-readable recording medium
US-2020185232-A1 · Jun 11, 2020 · US
Grinding wheel and grinding apparatus
US-10639761-B2 · May 5, 2020 · US
High frequency vibration spindle system with noncontact power transmission and method for manufacturing a restraining part used therein
US-2020070254-A1 · Mar 5, 2020 · US
High frequency vibration spindle system
US-10570985-B2 · Feb 25, 2020 · US
Nanofluid minimum quantity lubrication grinding device of ultrasonic vibration assisted grinding fluid micro-channel infiltration
US-2020023485-A1 · Jan 23, 2020 · US
Conveying accuracy related fault detectable integrated sheet body punching and grinding assembly
US-2019389021-A1 · Dec 26, 2019 · US
Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof
US-10513003-B2 · Dec 24, 2019 · US
Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US-2019352216-A1 · Nov 21, 2019 · US
Wafer thinning systems and related methods
US-2019333799-A1 · Oct 31, 2019 · US
Masking tool system and method
US-2019314949-A1 · Oct 17, 2019 · US
A precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof
US-2019291230-A1 · Sep 26, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B1/04?
- CPC B24B1/04 is the Cooperative Patent Classification code for “subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00).”
- How many patents are filed under CPC B24B1/04 (subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00))?
- Our database includes 134 publications tagged with this CPC code.
- Is patent activity under CPC B24B1/04 growing?
- Publication counts under this code: 12 in 2024 vs 15 in 2025 (latest complete years).