Modified repair solution, preparation method thereof, and method for repairing color resist

Patent metadata

Field	Value
Publication number	US-11271093-B2
Application number	US-201916627297-A
Country	US
Kind code	B2
Filing date	Nov 12, 2019
Priority date	Jul 22, 2019
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

The present invention provides a modified repair solution, a preparation method thereof, and a method for repairing color resist. Through adding additives to a photoresist solvent, a ketone compound in the modified repair solution is adsorbed on a surface of a source/drain metal layer to chemically react with a molecular linker to form a transparent colloid. The colloid is colorless and transparent, insoluble in water and organic solvent, and has strong adsorption with aluminum. After the transparent colloid is formed, further formation of the colloid is prevented, and aluminum is prevented from contacting with alkaline modified repair chemical solution, thereby preventing aluminum from being corroded; moreover, the chemical solution can be prevented from remaining in a damaged portion of a protective layer, and reaction with aluminum at high temperatures in post processing can be prevented, thereby preventing a vertical disconnection.

First claim

What is claimed is:

1. A modified repair solution, comprising:
a photoresist solvent, additives, and a solvent, wherein the additives comprise a ketone compound, a molecular linker, and a dispersant, the ketone compound has a structural formula of R 2 —O—R 3 —OH, and the molecular linker has a structural formula of HO—R 4 —N—OH.

2. The modified repair solution according to claim 1 , wherein the photoresist solvent has a structural formula of R 1 —N—OH, and the solvent is water.

3. The modified repair solution according to claim 1 , wherein each of R 2 , R 3 , and R 4 comprises one of an alkyl group, an alkoxy group, or an aromatic group.

4. A method for preparing a modified repair solution, comprising steps of:
providing a photoresist solvent comprising a hydroxyl group and nitrogen, additives, and a solvent, wherein the additives comprise a ketone compound, a molecular linker, and a dispersant, the ketone compound has a structural formula of R 2 —O—R 3 —H, and the molecular linker has a structural formula of HO—R 4 —N—OH;
putting the photoresist solvent and the additives into a container and performing ultrasonic dispersion at 50-60° C.; and
adding the solvent to the container to form the modified repair solution;
wherein the dispersant is used to uniformly dissolve the ketone compound in the solvent.

5. A method for repairing a color resist by a modified repair solution, comprising:
providing an array substrate and the modified repair solution according to claim 1 , wherein the array substrate is provided with a plurality of color resists, and the color resists comprise at least one defective color resist;
adding the modified repair solution to the at least one defective color resist to strip the at least one defective color resist; and
depositing a new color resist on a region of the array substrate corresponding to the at least one defective color resist.

6. The method for repairing the color resist by the modified repair solution according to claim 5 , wherein the array substrate comprises a source/drain metal layer and a protective layer, the protective layer is disposed on the source/drain metal layer, and a material of the source/drain metal layer is aluminum.

7. The method for repairing the color resist by the modified repair solution according to claim 6 , wherein the step of adding the modified repair solution to the at least one defective color resist further comprises:
forming a crack in the protective layer; and
contacting the modified repair solution with the source/drain metal layer through the crack, wherein the ketone compound in the modified repair solution is adsorbed on a surface of the source/drain metal layer and chemically reacts with the source/drain metal layer to form a transparent colloid, and the transparent colloid is used to block the modified repair solution from corroding the source/drain metal layer.

8. The method for repairing the color resist by the modified repair solution according to claim 7 , wherein the transparent colloid is insoluble in water, and the transparent colloid has a melting point of 280-330° C. and has a strong adsorption with aluminum.

9. The method for repairing the color resist by the modified repair solution according to claim 7 , wherein the transparent colloid has a structural formula of R 4 —N—O—R 3 —O—R 2 .

10. The method for repairing the color resist by the modified repair solution according to claim 6 , wherein in the step of adding the modified repair solution to the at least one defective color resist, the additives in the modified repair solution are adsorbed on a surface of the source/drain metal layer to undergo a chemical reaction, and the chemical reaction is an alkaline environment at a reaction temperature of 60-80° C.

Assignees

• Tcl China Star Optoelectronics Tech Co Ltd

Inventors

• Peng Can

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P76/204 Primary

  of organic photoresist masks · CPC title

• H10D30/0321

  comprising silicon, e.g. amorphous silicon or polysilicon · CPC title

• H10D30/0316 Primary

  of lateral bottom-gate TFTs comprising only a single gate · CPC title

• C09D5/08 Primary

  Anti-corrosive paints · CPC title