Boron nitride aggregated grain

US11268004B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11268004-B2
Application numberUS-201716339978-A
CountryUS
Kind codeB2
Filing dateAug 31, 2017
Priority dateOct 7, 2016
Publication dateMar 8, 2022
Grant dateMar 8, 2022

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 μm or more and 3.5 μm or less and a standard deviation of 1.2 μm or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 μm or more and 100 μm or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.

First claim

Opening claim text (preview).

The invention claimed is: 1. A boron nitride powder comprising boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristics (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 μm or more and 3.5 μm or less and a standard deviation of 1.2 μm or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 μm or more and 100 μm or less. 2. The boron nitride powder according to claim 1 , wherein the average particle diameter of the boron nitride powder (C) is 30 μm or more and 80 μm or less. 3. The boron nitride powder according to claim 1 , prepared by a method for producing a boron nitride powder characterized by the steps of: (a) pressure-nitridating and calcining a boron carbide having an average particle diameter of 6 μm or more and 55 μm or less and a carbon content of 18% or more and 21% or less and (b) heat-treating the boron carbide by heating it to a temperature allowing initiation of decarburization, heating it to a retention temperature at a heating rate of 5° C./min or less, and heating it at a temperature of 1750° C. or higher for a period longer than 0.5 hour and shorter than 40 hours in a decarburization crystallization step after the pressure nitridation and calcination. 4. The boron nitride powder according to claim 3 , wherein the boron carbide is pressure-nitridated and calcined at a temperature of 1800° C. or higher and at a pressure of 0.7 MPa or more and 1.0 MPa or less in the step (a). 5. A thermally conductive resin composition, comprising the boron nitride powder according to claim 1 .

Assignees

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Classifications

  • Binary compounds of nitrogen with boron · CPC title

  • Micrometer sized, i.e. from 1-100 micrometer · CPC title

  • Grinding · CPC title

  • Ingredients treated with inorganic substances · CPC title

  • Treatment or coating resulting in a free metal containing surface-region (C09C1/0078 takes precedence) · CPC title

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What does patent US11268004B2 cover?
A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 μm or more and 3.5 μm or less and a standard deviation of 1.2 μ…
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification C09C1/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).