3-D printed devices formed with conductive inks and method of making

Patent metadata

Field	Value
Publication number	US-11267981-B2
Application number	US-201916370210-A
Country	US
Kind code	B2
Filing date	Mar 29, 2019
Priority date	Apr 3, 2018
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A 3-D printed device comprising one or more interconnect structures, the interconnect structures comprising a plurality of conductive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a conductive ink composition; applying the conductive ink composition to a substrate in a 3-D solvent cast printing process to form one or more interconnect structures; and drying the one or more interconnect structures formed from the conductive ink composition. The dried interconnect structures exhibit a conductivity equal to or greater than 1×105 S/m without having to be subjected to any post-processing sintering treatment.

First claim

What is claimed is:

1. An extrudable conductive ink composition comprising a plurality of metal flakes having an aspect ratio defined by lengths in the x-, y-, and z-dimensions, such that the metal flakes have a z-dimension that is no more than 20% of the x-dimension and no more than 20% of the y-dimension, wherein said plurality of metal flakes is dispersed in a solvent along with one or more solubilized diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer, wherein the extrudable conductive ink composition exhibits high shear thinning such that the composition presents a low viscosity when passed through an extrusion nozzle and a higher viscosity upon deposition, wherein said plurality of metal flakes have a particle size in both x and y dimensions in a range of about 2 micrometers to about 15 micrometers.

2. The conductive ink composition of claim 1 , wherein the weight percentage of said metal flakes in the ink composition is between about 80% and 90%.

3. The conductive ink composition of claim 1 , wherein the solvent comprises a hydrocarbon solvent.

4. The conductive ink composition of claim 1 , wherein the solvent comprises an aromatic hydrocarbon solvent, or a bicyclic aromatic hydrocarbon solvent or tetralin.

5. The conductive ink composition of claim 1 , wherein the solvent has a vapor pressure less than 5-mm Hg at 20° C.

6. The conductive ink composition of claim 1 , wherein the solvent has an evaporation rate of less than 0.5.

7. The conductive ink composition of claim 1 , wherein the conductive ink composition further comprises a curable vinyl-containing monomer or mixture of vinyl-containing monomers.

8. The conductive ink composition of claim 1 , wherein the conductive ink composition further comprises a thermal or photo-induced free radical generator adapted to generate free radicals when subjected to heat or actinic radiation.

9. The conductive ink composition of claim 1 , wherein the conductive ink composition further comprises at least one of a sensitizer, a dye, a surfactant, a stabilizer, a colorant, an ultraviolet absorber, an antioxidant, or a defoaming agent.

10. The conductive ink composition of claim 1 , wherein the conductive ink composition further comprises at least one homopolymer, copolymer, terpolymer, or higher polymer in addition to the one or more diblock or triblock copolymers.

11. The conductive ink composition of claim 1 , wherein the weight percentage of the metal flakes in the ink composition is between about 85% and 90%.

12. The conductive ink composition of claim 1 , wherein the solvent has a vapor pressure less than 2 mm Hg at 20° C.

13. The conductive ink composition of claim 1 , wherein the solvent has a vapor pressure less than 1 mm Hg at 20° C.

14. The conductive ink composition of claim 1 , wherein the solvent has a vapor pressure less than 0.5 mm Hg at 20° C.

15. The conductive ink composition of claim 1 , wherein the solvent has an evaporation rate of less than 0.1.

16. The conductive ink composition of claim 1 , wherein the composition exhibits a shear thinning threshold of less than or equal to 0.02 rad/s.

17. The conductive ink composition of claim 1 , wherein the metal flakes comprise any of silver and gold.

Assignees

• Massachusetts Inst Technology
• Harvard College

Inventors

• Duncan Bradley P
• Plaut Maxwell E
• Fedynyshyn Theodore H
• Lewis Jennifer A

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• H01B1/20

  Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• C09D11/037

  characterised by the pigment · CPC title

• B29K2105/0085

  Copolymers · CPC title