Method of manufacturing chip module

Patent metadata

Field	Value
Publication number	US-11264351-B2
Application number	US-201715779706-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 19, 2017
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A method of manufacturing a chip module comprises a step of disposing a first electronic element 13 on a first jig 500 , a step of disposing a first connector 60 on the first electronic element 13 via a conductive adhesive 5 , a step of disposing a second electronic element 23 on the first connector 60 via a conductive adhesive 5 , a step of disposing a second connector 70 on a second jig 550 , a step of reversing the second jig in a state where the second connector 70 is fixed to the second jig 550 and disposing the second connector 70 on the second electronic element 23 via a conductive adhesive 5 , and a step of curing the conductive adhesives 5.

First claim

The invention claimed is:

1. A method of manufacturing a chip module used to manufacture an electronic module, the method comprising:
disposing a first electronic element, to be placed on a conductive layer or a metal substrate, on a first jig;
disposing a single first connector on the single first electronic element via a conductive adhesive in the first jig;
disposing a single second electronic element on the single first connector disposed on the first electronic element via a conductive adhesive in the first jig, and only the conductive adhesive is configured to exist between the single first connector and the single second electronic element;
disposing a second connector and a third connector, to be placed on a conductive layer or a metal substrate, on a second jig which is different from the first jig;
reversing the second jig in a state where the second connector is fixed to the second jig and disposing the single second connector on the single second electronic element via a conductive adhesive, wherein the second jig is configured to be reversed in a state where the second connector and the third connector are fixed to the second jig, and the second and the third connectors are disposed on the second electronic element via a conductive adhesive; and
curing the conductive adhesives.

2. The method of manufacturing the chip module according to claim 1 , wherein
the first connector has a plurality of supporting parts,
the second connector has a plurality of extending parts,
the supporting parts is configured to contact with the first jig when disposing the first connector on the first electronic element via the conductive adhesive and
the extending parts is configured to contact with the first jig when disposing the second connector on the second electronic element via the conductive adhesive.

3. The method of manufacturing the chip module, according to claim 1 , further comprising
disposing a third connector in the second jig,
wherein the second jig is configured to be reversed in a state where the second connector and the third connector are fixed to the second jig, and the second connector and the third connector are disposed on the second electronic element via a conductive adhesive.

4. The method of manufacturing the chip module according to claim 1 , wherein
the second connector has an extending part, and
the extending part is configured to contact with the first jig when disposing the second connector on the second electronic element via the conductive adhesive.

5. The method of manufacturing the chip module according to claim 1 , wherein
the first connector has a supporting part, and
the supporting part is configured to contact with the first jig when disposing the first connector on the first electronic element via the conductive adhesive.

6. The method of manufacturing the chip module according to claim 1 , wherein the first jig has a first jig recess corresponding to height of the chip module, or the second jig has a second jig recess corresponding to height of the chip module.

7. A method of manufacturing a chip module used to manufacture an electronic module, the method comprising:
disposing a first electronic element, to be placed on a conductive layer or a metal substrate, on a first jig;
disposing a second connector and a third connector, to be placed on a conductive layer or a metal substrate, on a second jig;
disposing a single second electronic element on the single second connector via a conductive adhesive in the second jig;
disposing a single first connector on the single second electronic element disposed on the second connector via a conductive adhesive in the second jig which is different from the first jig, and only the conductive adhesive is configured to exist between the single first connector and the single second electronic element;
reversing the first jig in a state where the first electronic element is fixed to the first jig and disposing the single first electronic element on the single first connector via a conductive adhesive, wherein the first jig is configured to be reversed in a state where the second connector and the third connector are fixed to the second jig, and the second and the third connectors are disposed on the second electronic element via a conductive adhesive; and
curing the conductive adhesives.

Assignees

• Shindengen Electric Mfg

Inventors

• Ikeda Kosuke
• Matsuzaki Osamu

Classifications

• H10W72/631

  Shapes of strap connectors · CPC title

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title