Three-phase inverter module

Patent metadata

Field	Value
Publication number	US-9893641-B2
Application number	US-201515304594-A
Country	US
Kind code	B2
Filing date	Apr 22, 2015
Priority date	May 7, 2014
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

In an upper phase module 2 , a second electrode terminal 24 V is located at a center C 1 of the upper phase module 2 , and a first electrode terminal 24 U and a third electrode terminal 24 W, and a first P terminal 25 P and a second P terminal 26 P are located so as to be symmetric with respect to the second electrode terminal 24 V in an X-direction. The first electrode terminal 24 U, the second electrode terminal 24 V, the third electrode terminal 24 W, the first P terminal 25 P and the second P terminal 26 P of the upper phase module 2 are located at the same positions as those of a fourth electrode terminal 34 U, a fifth electrode terminal 34 V, a sixth electrode terminal 34 W, a first N terminal 35 N and a second N terminal 36 N of a lower phase module 3 , respectively, in the X-direction.

First claim

The invention claimed is:

1. A three-phase inverter module comprising:
an upper phase module and a lower phase module which are opposite to each other,
wherein the upper phase module includes
a first electrode, a second electrode and a third electrode which are arranged in a first direction perpendicular to an opposite direction between the upper phase module and the lower phase module,
a P electrode which is connected to the first electrode, the second electrode and the third electrode through a first semiconductor device portion, a second semiconductor device portion and a third semiconductor device portion, respectively,
an upper phase mold portion in which the first electrode, the second electrode, the third electrode and the P electrode are formed integrally with each other,
a first electrode terminal that protrudes from the first electrode in a second direction perpendicular to the first direction,
a second electrode terminal that protrudes from the second electrode in the second direction,
a third electrode terminal that protrudes from the third electrode in the second direction, and
a first P terminal and a second P terminal that protrude from the P electrode in the first direction or the second direction,
the lower phase module includes
a fourth electrode, a fifth electrode and a sixth electrode which are arranged in the first direction,
an N electrode which is connected to the fourth electrode, the fifth electrode and the sixth electrode through a fourth semiconductor device portion, a fifth semiconductor device portion and a sixth semiconductor device portion, respectively,
a lower phase mold portion in which the fourth electrode, the fifth electrode, the sixth electrode and the N electrode are formed integrally with each other, and which has the same shape as that of the upper phase mold portion,
a fourth electrode terminal that protrudes from the fourth electrode in the second direction,
a fifth electrode terminal that protrudes from the fifth electrode in the second direction,
a sixth electrode terminal that protrudes from the sixth electrode in the second direction, and
a first N terminal and a second N terminal that protrude from the N electrode in the first direction or the second direction,
the first electrode terminal and the fourth electrode terminal, the second electrode terminal and the fifth electrode terminal, the third electrode terminal and the sixth electrode terminal, the first P terminal and the first N terminal, and the second P terminal and the second N terminal are located at the same positions, respectively, in the first direction,
in the respective terminals included in the upper phase module and the respective terminals included in the lower phase module, one terminal of the respective terminals is a central terminal which is located at a center of the upper phase module or the lower phase module in the first direction, a pair of terminals other than the central terminal are a first inside terminal and a second inside terminal that protrude from positions symmetric with respect to the central terminal in the first direction, and from the same position in a third direction perpendicular to the first direction and the second direction, and a remaining pair of terminals are a first outside terminal and a second outside terminal which are located outside a region between the first inside terminal and the second inside terminal in the first direction, and
the first outside terminal and the second outside terminal protrude from positions symmetric with respect to the central terminal in the first direction, and from the same position in the third direction.

2. The three-phase inverter module according to claim 1 , wherein the upper phase module and the lower phase module are laminated with an insulating portion interposed therebetween in the opposite direction.

3. The three-phase inverter module according to claim 1 , wherein the second electrode terminal is the central terminal,
the first electrode terminal and the third electrode terminal protrude from positions symmetric with respect to the second electrode terminal in the first direction, and
the first P terminal and the second P terminal protrude from the positions symmetric with respect to the second electrode terminal in the first direction.

4. The three-phase inverter module according to claim 1 , wherein the first P terminal and the second P terminal are the first inside terminal and the second inside terminal.

5. The three-phase inverter module according to claim 1 , wherein the upper phase module further includes
a first signal line, connected to the first semiconductor device portion, which protrudes from the upper phase mold portion in the second direction,
a second signal line, connected to the second semiconductor device portion, which protrudes from the upper phase mold portion in the second direction, and
a third signal line, connected to the third semiconductor device portion, which protrudes from the upper phase mold portion in the second direction,
the lower phase module further includes
a fourth signal line, connected to the fourth semiconductor device portion, which protrudes from the lower phase mold portion in the second direction,
a fifth signal line, connected to the fifth semiconductor device portion, which protrudes from the lower phase mold portion in the second direction, and
a sixth signal line, connected to the sixth semiconductor device portion, which protrudes from the lower phase mold portion in the second direction,
the first signal line and the fourth signal line, the second signal line and the fifth signal line, and the third signal line and the sixth signal line are located at the same positions, respectively, in the first direction,
the second signal line is located at the center of the upper phase module in the first direction, and
the first signal line and the third signal line protrude from positions symmetric with respect to the second signal line in the first direction, and from the same position in the third direction.

Assignees

• Toyota Motor Co Ltd

Inventors

• Nakajima Kiyofumi
• Ide Yuki

Classifications

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/655

  of outermost layers of multilayered strap connectors, e.g. material of a coating · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title