Chamber lid with integrated heater

Patent metadata

Field	Value
Publication number	US-11264252-B2
Application number	US-201916561907-A
Country	US
Kind code	B2
Filing date	Sep 5, 2019
Priority date	Oct 12, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Implementations described herein provide a chamber lid assembly. In one embodiment, a chamber lid assembly includes a heater embedded in a dielectric body forming a boundary of a processing chamber, wherein the heater has one or more heating zones that are independently controlled.

First claim

What is claimed is:

1. A chamber lid assembly, comprising:
a dielectric plate configured to seal a processing chamber; and
a heater disposed within the dielectric plate, wherein the heater has one or more heating zones that are independently controlled, and wherein the heater comprises a plurality of radially oriented spokes, at least a portion of the radially oriented spokes being joined by a first arc segment at an outer diameter position and a second arc segment at an inner diameter position.

2. The lid assembly of claim 1 , wherein the dielectric plate comprises a ceramic material.

3. The lid assembly of claim 1 , wherein the one or more heating zones comprises an inner zone and an outer zone.

4. The lid assembly of claim 1 , wherein the dielectric plate is laminated.

5. The lid assembly of claim 1 , wherein the heater is coupled to a terminal assembly.

6. The lid assembly of claim 5 , wherein the terminal assembly is positioned on a peripheral edge of the dielectric plate.

7. The lid assembly of claim 1 , wherein the heater includes an inner trace and an outer trace.

8. The lid assembly of claim 7 , wherein the inner trace and the outer trace include a plurality of arc segments.

9. The lid assembly of claim 8 , wherein each of the plurality of arc segments are joined to the radially oriented spokes.

10. A processing chamber, comprising: a chamber body; a substrate support assembly disposed in the chamber body; and a lid assembly, the lid assembly comprising: a dielectric plate configured to seal the processing chamber; and a heater disposed within the dielectric plate, wherein the heater comprises a plurality of radially oriented spokes, at least a portion of which are joined by a first arc segment at an outer diameter position and a second arc segment at an inner diameter position, and wherein the heater has one or more heating zones that are independently controlled.

11. The chamber of claim 10 , wherein the one or more heating zones comprises an inner zone and an outer zone.

12. The chamber of claim 10 , wherein the dielectric plate is laminated.

13. The chamber of claim 10 , wherein the heater is coupled to a terminal assembly.

14. The chamber of claim 13 , wherein the terminal assembly is positioned on a peripheral edge of the dielectric plate.

15. The chamber of claim 10 , wherein the heater includes an inner trace and an outer trace.

16. The chamber of claim 15 , wherein the inner trace and the outer trace include a plurality of arc segments.

17. The chamber of claim 16 , wherein a portion of the plurality of arc segments are joined to the radially oriented spokes.

18. A processing chamber, comprising: a chamber body; a substrate support assembly disposed in the chamber body; and a lid assembly, the lid assembly comprising: a dielectric plate configured to seal the processing chamber a heater disposed within the dielectric plate; and an electromagnetic shield embedded in the dielectric plate adjacent to the heater, wherein the heater comprises a plurality of radially oriented spokes, and wherein the heater has one or more heating zones that are independently controlled.

19. The processing chamber of claim 18 , wherein the electromagnetic shield is above the heater.

20. The processing chamber of claim 18 , wherein the electromagnetic shield comprises a shape that substantially matches a shape of the heater in plan view.

Assignees

• Applied Materials Inc

Inventors

• Willwerth Michael D
• Ludwig Jeffrey
• Schwarz Benjamin
• Cotlear Roberto Cesar

Classifications

• H10P72/0418 Primary

  for etching · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H01J37/32522

  Temperature · CPC title

• H01J37/32477 Primary

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title