Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal

Patent metadata

Field	Value
Publication number	US-11264207-B2
Application number	US-202016855666-A
Country	US
Kind code	B2
Filing date	Apr 22, 2020
Priority date	Dec 10, 2015
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power. The isolation system further includes a plurality of channel paths connected to the input junction for distributing the RF power among the channel paths. The isolation system includes an output junction connected between each of the channel paths and to an electrode of a plasma chamber for receiving portions of the distributed RF power to output combined power and providing the combined RF power to the electrode. Each of the channel paths includes bottom and top capacitors for blocking a signal of the different type than that of the RF power. The isolation system avoids a risk of electrical arcing created by a voltage difference between an RF terminal and a non-RF terminal when the terminals are placed proximate to each other.

First claim

The invention claimed is:

1. A slip ring assembly comprising:
a first circuit channel having a first filter, a slip ring portion, and a second filter, wherein the slip ring portion of the first circuit channel is coupled between the first and second filters of the first circuit channel, wherein the first and second filters of the first circuit channel are configured to filter non-radio frequency (RF) power; and
a second circuit channel having a first filter, a slip ring portion, and a second filter, wherein the slip ring portion of the second circuit channel is coupled between the first and second filters of the second circuit channel, wherein the first and second filters of the second circuit channel are configured to filter non-RF power,
wherein the first circuit channel is coupled to the second circuit channel.

2. The slip ring assembly of claim 1 , wherein the first filter of the first circuit channel is a first capacitor and the second filter of the first circuit channel is a second capacitor, wherein the slip ring portion of the first circuit channel is a coupling between the first capacitor and the second capacitor.

3. The slip ring assembly of claim 2 , wherein the first capacitor has a first end and a second end, wherein the second capacitor has a first end and a second end, wherein the slip ring portion of the first circuit channel is coupled to the first end of the first capacitor and is coupled to the first end of the second capacitor, wherein the second end of the first capacitor is configured to be coupled to an electrode of a plasma chamber and the first end of the first capacitor is configured to be coupled to a heater element of the plasma chamber.

4. The slip ring assembly of claim 3 , wherein the first end of the second capacitor is configured to be coupled to a power source via an RF filter to receive non-RF power via the RF filter and the second end of the second capacitor is configured to be coupled to a distributor and combiner to receive RF power from the distributor and combiner.

5. The slip ring assembly of claim 2 , wherein the first capacitor has a first end and a second end, wherein the second capacitor has a first end and a second end, wherein the slip ring portion of the first circuit channel is coupled to the first end of the first capacitor and is coupled to the first end of the second capacitor, wherein the second end of the first capacitor is configured to be coupled to an electrode of a plasma chamber and the first end of the first capacitor is configured to be coupled to a thermocouple associated with the plasma chamber.

6. The slip ring assembly of claim 5 , wherein the first end of the second capacitor is configured to be coupled to a controller via an RF filter to transfer non-RF power via the RF filter to the controller and the second end of the second capacitor is configured to be coupled to a distributor and combiner to receive RF power from the distributor and combiner.

7. The slip ring assembly of claim 1 , wherein the first filter of the second circuit channel is a first capacitor and the second filter of the second circuit channel is a second capacitor, wherein the slip ring portion of the second circuit channel is a coupling between the first capacitor and the second capacitor.

8. The slip ring assembly of claim 7 , wherein the first capacitor has a first end and a second end, wherein the second capacitor has a first end and a second end, wherein the slip ring portion of the second circuit channel is coupled to the first end of the first capacitor and is coupled to the first end of the second capacitor, wherein the second end of the first capacitor is configured to be coupled to an electrode of a plasma chamber and the first end of the first capacitor is configured to be coupled to a heater element of the plasma chamber.

9. The slip ring assembly of claim 8 , wherein the first end of the second capacitor is configured to be coupled to a power source via an RF filter to receive non-RF power via the RF filter and the second end of the second capacitor is configured to be coupled to a distributor and combiner to receive RF power from the distributor and combiner.

10. The slip ring assembly of claim 7 , wherein the first capacitor has a first end and a second end, wherein the second capacitor has a first end and a second end, wherein the slip ring portion of the second circuit channel is coupled to the first end of the first capacitor and is coupled to the first end of the second capacitor, wherein the second end of the first capacitor is configured to be coupled to an electrode of a plasma chamber and the first end of the first capacitor is configured to be coupled to a thermocouple associated with the plasma chamber.

11. The slip ring assembly of claim 10 , wherein the first end of the second capacitor is configured to be coupled to a controller via an RF filter to transfer non-RF power via the RF filter to the controller and the second end of the second capacitor is configured to be coupled to a distributor and combiner to receive RF power from the distributor and combiner.

12. A plasma system comprising:
a first radio frequency (RF) generator configured to generate a first RF signal;
a second RF generator configured to generate a second RF signal;
a first impedance matching circuit coupled to the first RF generator, wherein the first impedance matching circuit is configured to output a first modified RF signal upon receiving the first RF signal;
a second impedance matching circuit coupled to the second RF generator, wherein the second impedance matching circuit is configured to output a second modified RF signal upon receiving the second RF signal;
a combiner and distributor coupled to the first impedance matching circuit and the second impedance matching circuit, wherein the combiner and distributor is configured to receive the first and second modified RF signals to output a plurality of output RF signals;
a slip ring assembly coupled to the combiner and distributor for receiving one of the plurality of output RF signals, wherein the slip ring assembly includes:
a first circuit channel having a first filter, a slip ring portion, and a second filter, wherein the slip ring portion of the first circuit channel is coupled between the first and second filters of the first circuit channel, wherein the first filter of the first circuit channel is configured to filter non-RF power and allow passage of RF power of the one of the plurality of output RF signals; and
a second circuit channel having a first filter, a slip ring portion, and a second filter, wherein the slip ring portion of the second circuit channel is coupled between the first and second filters of the second circuit channel, wherein the first filter of the second circuit channel is configured to filter non-RF power and allow passage of RF power of the one of the plurality of output RF signals,
wherein the first circuit channel is coupled to the second circuit channel.

13. The plasma system of claim 12 , wherein the first filter of the first circuit channel is a first capacitor and the second filter of the first circuit channel is a second capacitor, wherein the slip ring portion of the first circuit channel is a coupling between the first capacitor and the second capacitor.

14. The plasma system of claim 13 , wherein the first capacitor has a first end and a second end, wherein the second capacitor has a first end and a second end, wherein the slip ring portion of the first circuit channel is coupled to the first end of the first capacitor and is coupled to the first end of the second capacitor, wherein the second end of the first capaci

Assignees

• Lam Res Corp

Inventors

• Kim Hyungjoon
• Kapoor Sunil
• Leeser Karl
• Burkhart Vince

Classifications

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H01J2237/3321

  CVD [Chemical Vapor Deposition] · CPC title

• C23C16/505

  using radio frequency discharges · CPC title